公开(公告)号：US10096508B2

公开(公告)日：2018-10-09

申请号：US14826223

申请日：2015-08-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Ronald Paramio Joves ,  Thanabal Ganesh Kunamani ,  Kuang Ming Lee ,  Avelino Oliveros Sumagpoa ,  Kian Heong Tan ,  Nestor Vergara Bicomong ,  Jagen Krishnan ,  Soon Hock Tong

IPC: B32B38/10 ,  H01L21/683 ,  B25J11/00 ,  B32B37/00 ,  H01L21/67 ,  B32B43/00

Abstract: In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.