公开(公告)号：US20150203350A1

公开(公告)日：2015-07-23

申请号：US14675672

申请日：2015-03-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Thoralf KAUTZSCH ,  Boris BINDER ,  Torsten HELM ,  Stefan KOLB ,  Marc PROBST ,  Uwe RUDOLPH

IPC: B81C1/00

CPC classification number: B81C1/00523 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  B81C1/0038

Abstract: Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.

Abstract translation: 描述和描述了与半导体制造相关的实施例和具有半导体结构的半导体器件。