PHOTOACOUSTIC SENSORS AND MEMS DEVICES

    公开(公告)号:US20230116926A1

    公开(公告)日:2023-04-20

    申请号:US18069371

    申请日:2022-12-21

    Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

    METHOD FOR DOPING AN ACTIVE HALL EFFECT REGION OF A HALL EFFECT DEVICE AND HALL EFFECT DEVICE HAVING A DOPED ACTIVE HALL EFFECT REGION
    2.
    发明申请
    METHOD FOR DOPING AN ACTIVE HALL EFFECT REGION OF A HALL EFFECT DEVICE AND HALL EFFECT DEVICE HAVING A DOPED ACTIVE HALL EFFECT REGION 有权
    用于对具有有效霍尔效应区域的霍尔效应器件和霍尔效应器件进行有效霍尔效应区域的方法

    公开(公告)号:US20160268498A1

    公开(公告)日:2016-09-15

    申请号:US15069370

    申请日:2016-03-14

    CPC classification number: H01L43/04 G01R33/0052 G01R33/07 H01L43/065 H01L43/14

    Abstract: Methods for doping an active Hall effect region of a Hall effect device in a semiconductor substrate, and Hall effect devices having a doped active Hall effect region are provided. A method includes forming a first doping profile of a first doping type in a first depth region of the active Hall effect region by means of a first implantation with a first implantation energy level, forming a second doping profile of the first doping type in a second depth region of the active Hall effect region by means of a second implantation with a second implantation energy level, and forming an overall doping profile of the active Hall effect region by annealing the semiconductor substrate with the active Hall effect region having the first and the second doping profile.

    Abstract translation: 在半导体衬底中掺杂霍尔效应器件的有源霍尔效应区域的方法以及具有掺杂的有源霍尔效应区域的霍尔效应器件。 一种方法包括通过具有第一注入能级的第一注入,在有源霍尔效应区的第一深度区域中形成第一掺杂类型的第一掺杂分布,在第二掺杂分布中形成第一掺杂类型的第二掺杂分布 通过具有第二注入能级的第二注入,激活霍尔效应区的深度区域,并且通过用具有第一和第二的有源霍尔效应区域退火半导体衬底来形成有源霍尔效应区的整体掺杂分布 掺杂型材

    PHOTOACOUSTIC SENSORS AND MEMS DEVICES

    公开(公告)号:US20210181151A1

    公开(公告)日:2021-06-17

    申请号:US17116029

    申请日:2020-12-09

    Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

    Apparatus and Method for In-Situ Calibration of a Photoacoustic Sensor
    6.
    发明申请
    Apparatus and Method for In-Situ Calibration of a Photoacoustic Sensor 审中-公开
    光声传感器的现场校准装置和方法

    公开(公告)号:US20170067859A1

    公开(公告)日:2017-03-09

    申请号:US15258646

    申请日:2016-09-07

    CPC classification number: G01N29/30 G01N29/2418 G01N2291/021

    Abstract: An apparatus for in-situ calibration of a photoacoustic sensor is provided. The apparatus includes a light emitter to emit light along a transmission path to a gas and an acoustic sensor element configured to detect an acoustic signal emitted from the gas based on the received light. Furthermore, the apparatus includes a sensing unit configured to detect the light transmitted along the transmission path and to provide an output signal, and a calibration unit to receive the output signal from the sensing unit and to provide a calibration information based on the output signal received from the sensing unit.

    Abstract translation: 提供了一种用于光声传感器的原位校准的装置。 该装置包括:发光体,沿着沿气体的传输路径发光;以及声传感器元件,被配置为基于接收的光检测从气体发出的声信号。 此外,该装置包括:感测单元,被配置为检测沿着传输路径传输的光并提供输出信号,以及校准单元,用于接收来自感测单元的输出信号,并且基于接收的输出信号提供校准信息 从感测单元。

    GAS CONCENTRATION DETECTION BY MEANS OF THERMOACOUSTIC SOUND WAVE

    公开(公告)号:US20220074897A1

    公开(公告)日:2022-03-10

    申请号:US17446507

    申请日:2021-08-31

    Abstract: A gas sensor having a heater, a receiver, and a space arranged between the heater and the receiver, is described, the heater being configured to generate a thermoacoustic sound wave propagating through the space by using a stimulation signal. The receiver is in this case configured to receive the thermoacoustic sound wave that has propagated through the space and to convert it into a reception signal that has a time-of-flight-dependent shift with respect to the stimulation signal and therefore information relating to the gas concentration in the space.

    MEMS DEVICE AND METHOD FOR MANUFACTURING A MEMS DEVICE
    10.
    发明申请
    MEMS DEVICE AND METHOD FOR MANUFACTURING A MEMS DEVICE 审中-公开
    用于制造MEMS器件的MEMS器件和方法

    公开(公告)号:US20160060105A1

    公开(公告)日:2016-03-03

    申请号:US14832001

    申请日:2015-08-21

    CPC classification number: B81C1/00182 B81C2201/019

    Abstract: A method for producing a MEMS device comprises forming a semiconductor layer stack, the semiconductor layer stack comprising at least a first monocrystalline semiconductor layer, a second monocrystalline semiconductor layer and a third monocrystalline semiconductor layer, the second monocrystalline semiconductor layer formed between the first and third monocrystalline semiconductor layers. A semiconductor material of the second monocrystalline semiconductor layer is different from semiconductor materials of the first and third monocrystalline semiconductor layers. After forming the semiconductor layer stack, at least a portion of each of the first and third monocrystalline semiconductor layers is concurrently etched.

    Abstract translation: 一种用于制造MEMS器件的方法包括形成半导体层堆叠,所述半导体层堆叠包括至少第一单晶半导体层,第二单晶半导体层和第三单晶半导体层,所述第二单晶半导体层形成在第一和第三 单晶半导体层。 第二单晶半导体层的半导体材料与第一和第三单晶半导体层的半导体材料不同。 在形成半导体层堆叠之后,同时蚀刻第一和第三单晶半导体层中的每一个的至少一部分。

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