公开(公告)号：US20180090848A1

公开(公告)日：2018-03-29

申请号：US15277504

申请日：2016-09-27

Applicant: INTEL CORPORATION

Inventor： ADEL A. ELSHERBINI ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  GEORGIOS C. DOGIAMIS ,  SHAWNA M. LIFF ,  ALEKSANDAR ALEKSOV ,  TELESPHOR KAMGAING

IPC: H01Q13/10 ,  H01Q1/50 ,  H01Q1/22

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

公开(公告)号：US20200098710A1

公开(公告)日：2020-03-26

申请号：US16465545

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： VIYAY K. NAIR ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  TELESPHOR KAMGAING ,  GEORGIOS C. DOGIAMIS ,  ADEL A. ELSHERBINI

IPC: H01L23/66 ,  H01L23/538 ,  H01P3/16

Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.