公开(公告)号：US20180287773A1

公开(公告)日：2018-10-04

申请号：US15475827

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： TELESPHOR KAMGAING ,  GEORGIOS C. DOGIAMIS ,  SASHA N. OSTER

IPC: H04L7/00 ,  H04L7/033 ,  H04B10/61 ,  H04B10/548

CPC classification number: H04L7/0075 ,  H04B10/548 ,  H04B10/6165 ,  H04B10/90 ,  H04L7/0331

Abstract: The present disclosure is directed to systems and methods for communicating between rack mounted devices disposed in the same or different racks separated by distances of less than a meter to a few tens of meters. The system includes a CMOS first mm-wave engine that includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. The CMOS first mm-wave engine communicably couples to a CMOS second mm-wave engine that also includes mm-wave transceiver circuitry, mm-wave MODEM circuitry, power distribution and control circuitry, and a mm-wave waveguide connector. In some implementations, at least a portion of the mm-wave transceiver circuitry may be fabricated using III-V semiconductor manufacturing methods. The use of mm-wave communication techniques beneficially improves data integrity and increases achievable datarates, and reduces power costs.

公开(公告)号：US20180090848A1

公开(公告)日：2018-03-29

申请号：US15277504

申请日：2016-09-27

Applicant: INTEL CORPORATION

Inventor： ADEL A. ELSHERBINI ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  GEORGIOS C. DOGIAMIS ,  SHAWNA M. LIFF ,  ALEKSANDAR ALEKSOV ,  TELESPHOR KAMGAING

IPC: H01Q13/10 ,  H01Q1/50 ,  H01Q1/22

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

公开(公告)号：US20160161957A1

公开(公告)日：2016-06-09

申请号：US15019740

申请日：2016-02-09

Applicant: INTEL CORPORATION

Inventor： KYU OH LEE ,  SASHA N. OSTER ,  FERAS EID ,  SARAH HANEY

IPC: G05D16/20 ,  B81C1/00 ,  B81B3/00

CPC classification number: G05D16/2026 ,  B81B3/0027 ,  B81B7/007 ,  B81B7/008 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/094 ,  B81C1/00158 ,  B81C1/00238 ,  B81C1/00246 ,  B81C1/00333 ,  B81C1/00547 ,  B81C2201/056 ,  B81C2203/0172 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: A pressure sensor is integrated into an integrated circuit fabrication and packaging flow. In one example, a releasable layer is formed over a removable core. A first dielectric layer is formed. A metal layer is patterned to form conductive metal paths and to form a diaphragm with the metal. A second dielectric layer is formed over the metal layer and the diaphragm. A second metal layer is formed to connect with formed vias and to form a metal mesh layer over the diaphragm. The first dielectric layer is etched under the diaphragm to form a cavity and the cavity is covered to form a chamber adjoining the diaphragm.

Abstract translation: 压力传感器集成到集成电路制造和封装流程中。 在一个示例中，在可移除的核上形成可释放层。 形成第一介电层。 图案化金属层以形成导电金属路径并与金属形成隔膜。 第二电介质层形成在金属层和隔膜上。 形成第二金属层以与形成的通孔连接并在隔膜上形成金属网格层。 第一电介质层被刻蚀在隔膜下面以形成空腔，并且空腔被覆盖以形成与隔膜相邻的室。

公开(公告)号：US20200098710A1

公开(公告)日：2020-03-26

申请号：US16465545

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： VIYAY K. NAIR ,  SASHA N. OSTER ,  JOHANNA M. SWAN ,  TELESPHOR KAMGAING ,  GEORGIOS C. DOGIAMIS ,  ADEL A. ELSHERBINI

IPC: H01L23/66 ,  H01L23/538 ,  H01P3/16

Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.

公开(公告)号：US20170089865A1

公开(公告)日：2017-03-30

申请号：US14865455

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： SASHA N. OSTER ,  FERAS EID ,  INDIRA NEGI

IPC: G01N29/22 ,  G01N33/543

CPC classification number: G01N29/22 ,  G01N29/022 ,  G01N29/036 ,  G01N33/54373 ,  G01N2291/014 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2600/00

Abstract: An embodiment includes a package comprising: a cavity formed in a dielectric material; a beam in the cavity; an interconnect to couple the beam to a current source; a magnet coupled to the cavity; and a polymer, on the beam, having an affinity to an analyte; wherein (a) a vertical axis intersects the magnet, the cavity, and the beam; (b) in a first state the beam and the polymer, which is not coupled to the analyte, collectively have a first mass and resonate at a first resonant frequency when the beam conducts a first current; and (c) in a second state the beam and the polymer, which is coupled to the analyte, collectively have a second mass that is greater than the first mass and resonate at a second resonant frequency when the beam conducts a second current. Other embodiments are described herein.