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公开(公告)号:US09524712B2
公开(公告)日:2016-12-20
申请号:US14841382
申请日:2015-08-31
Applicant: INTEL CORPORATION
Inventor: Ajay Kumar Vaidhyanathan , Ramaswamy Partha Parthasarathy , Sudarshan D. Solanki , Bala P. Subramanya , Yagnesh V. Waghela , Vikas Mishra , Devon Worrell
IPC: G10K11/178
CPC classification number: G10K11/178 , G10K2210/1081 , G10K2210/3026 , G10K2210/3028 , H04R1/1083 , H04R5/033 , H04R5/04
Abstract: Adaptive filtering is described for use with amplifiers for any wired speaker. In one example, an apparatus includes an audio cable to provide an analog audio signal to an audio transducer, such as a speaker, the audio cable also receiving a modulated noise current, an output amplifier to receive an audio input, to generate an audio output by amplifying the audio input, and to provide the audio input to the audio cable, and a feedback system to receive the audio output and to receive a reference signal and to generate a noise cancellation signal to the output amplifier, the noise cancellation signal to cancel the modulated noise current.
Abstract translation: 描述适用于任何有线扬声器的放大器使用自适应滤波。 在一个示例中,设备包括音频电缆,以向诸如扬声器的音频换能器提供模拟音频信号,音频电缆还接收调制的噪声电流,输出放大器以接收音频输入,以产生音频输出 通过放大音频输入,并向音频电缆提供音频输入,以及反馈系统,用于接收音频输出并接收参考信号并产生噪声消除信号到输出放大器,消除噪声消除信号以消除 调制噪声电流。
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公开(公告)号:US20230291485A1
公开(公告)日:2023-09-14
申请号:US18123501
申请日:2023-03-20
Applicant: Intel Corporation
Inventor: Sudarshan Dilip Solanki , Bala P. Subramanya , Soumyakanti Roy , Yagnesh V. Waghela
IPC: H04B17/345 , H04B17/318 , H04B1/525
CPC classification number: H04B17/345 , H04B1/525 , H04B17/318
Abstract: An example of an apparatus may include signal circuitry to provide a first set of one or more signals and a second set of one or more signals for an electronic device, and radio frequency interference (RFI) mitigation circuitry coupled to one or more of the signal circuitry, the first set, and the second set to provide a delay between respective signals of the first and second sets based on RFI mitigation information associated with the respective signals. Other examples are disclosed and claimed.
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公开(公告)号:US20220015273A1
公开(公告)日:2022-01-13
申请号:US17483415
申请日:2021-09-23
Applicant: Intel Corporation
Inventor: Bala P. Subramanya , Prakash Kurma Raju , Navneet K. Singh , Sachin Bedare , Vijith Halestoph R.
Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
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