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    Single wire communication board-to-board interconnect
    1.
    发明授权
    Single wire communication board-to-board interconnect 有权

    公开(公告)号：US10366035B2

    公开(公告)日：2019-07-30

    申请号：US15473330

    申请日：2017-03-29

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

    IPC: H01P3/10 ,  G06F13/40 ,  H01P5/08 ,  G06F13/42 ,  H01P5/02

    Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

    Adaptive filtering for wired speaker amplifiers
    4.
    发明授权
    Adaptive filtering for wired speaker amplifiers 有权
    有线扬声器放大器的自适应滤波

    公开(公告)号：US09524712B2

    公开(公告)日：2016-12-20

    申请号：US14841382

    申请日：2015-08-31

    Applicant: INTEL CORPORATION

    Inventor： Ajay Kumar Vaidhyanathan ,  Ramaswamy Partha Parthasarathy ,  Sudarshan D. Solanki ,  Bala P. Subramanya ,  Yagnesh V. Waghela ,  Vikas Mishra ,  Devon Worrell

    IPC: G10K11/178

    CPC classification number: G10K11/178 ,  G10K2210/1081 ,  G10K2210/3026 ,  G10K2210/3028 ,  H04R1/1083 ,  H04R5/033 ,  H04R5/04

    Abstract: Adaptive filtering is described for use with amplifiers for any wired speaker. In one example, an apparatus includes an audio cable to provide an analog audio signal to an audio transducer, such as a speaker, the audio cable also receiving a modulated noise current, an output amplifier to receive an audio input, to generate an audio output by amplifying the audio input, and to provide the audio input to the audio cable, and a feedback system to receive the audio output and to receive a reference signal and to generate a noise cancellation signal to the output amplifier, the noise cancellation signal to cancel the modulated noise current.

    Abstract translation: 描述适用于任何有线扬声器的放大器使用自适应滤波。 在一个示例中，设备包括音频电缆，以向诸如扬声器的音频换能器提供模拟音频信号，音频电缆还接收调制的噪声电流，输出放大器以接收音频输入，以产生音频输出 通过放大音频输入，并向音频电缆提供音频输入，以及反馈系统，用于接收音频输出并接收参考信号并产生噪声消除信号到输出放大器，消除噪声消除信号以消除 调制噪声电流。

    APPARATUS AND METHOD FOR DETECTING WARPAGE IN AN ELECTRONIC SYSTEM
    5.
    发明申请
    APPARATUS AND METHOD FOR DETECTING WARPAGE IN AN ELECTRONIC SYSTEM 有权

    公开(公告)号：US20250004044A1

    公开(公告)日：2025-01-02

    申请号：US18344869

    申请日：2023-06-30

    Applicant: Intel Corporation

    Inventor： Vijay HOSAMANI ,  Vikas Mishra ,  Kavitha Nagarajan ,  Zaman Zaid Mulla

    IPC: G01R31/28 ,  H05K1/02

    Abstract: The present disclosure generally relates to an electronic system including a semiconductor package and a circuit board. The semiconductor package and the circuit board may include contact structures configurable to have an output terminal of one contact structure connected to an input terminal of another contact structure so as to render a continuous electrical pathway through the contact structures, wherein the contact structures may be configured in a daisy chain manner forming a series connection, and wherein the continuous electrical pathway may render an output pattern in response to an electrical stimulus introduced to the electronic system.

    SINGLE WIRE COMMUNICATION BOARD-TO-BOARD INTERCONNECT
    7.
    发明申请
    SINGLE WIRE COMMUNICATION BOARD-TO-BOARD INTERCONNECT 审中-公开

    公开(公告)号：US20180287239A1

    公开(公告)日：2018-10-04

    申请号：US15473330

    申请日：2017-03-29

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

    IPC: H01P3/10 ,  H01P5/08 ,  G06F13/42 ,  G06F13/40

    CPC classification number: G06F13/4068 ,  G06F13/4282 ,  H01P5/026 ,  H01P5/08 ,  Y02D10/14 ,  Y02D10/151

    Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

    SINGLE WIRE COMMUNICATION ARRANGEMENT
    8.
    发明申请
    SINGLE WIRE COMMUNICATION ARRANGEMENT 审中-公开

    公开(公告)号：US20180241110A1

    公开(公告)日：2018-08-23

    申请号：US15440993

    申请日：2017-02-23

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

    IPC: H01P1/24 ,  H01R4/18 ,  H01R13/24 ,  H01F7/06 ,  H01P3/10 ,  H01P5/08

    CPC classification number: H01P5/08 ,  H01P3/10 ,  H01R13/6461 ,  H01R13/6477

    Abstract: Embodiments of the present disclosure provide an arrangement for single wire communications (SWC) for an electronic device. In one instance, the arrangement may comprise a cable assembly to connect with the electronic device, wherein the cable assembly may include a wire to conduct SWC and a cover portion to cover a portion of the wire. The cover portion may comprise a ferro-dielectric material. The arrangement may further include a control logic coupled with the cable assembly, to adjust characteristics associated with the ferro-dielectric material, to tune a signal termination impedance value associated with the cable assembly. Other embodiments may be described and/or claimed.

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