公开(公告)号：US10356902B2

公开(公告)日：2019-07-16

申请号：US14757984

申请日：2015-12-26

Applicant: INTEL CORPORATION

Inventor： Chee Ling Wong ,  Wil Choon Song ,  Khang Choong Yong ,  Eng Huat Goh ,  Mohd Muhaiyiddin Bin Abdullah ,  Tin Poay Chuah

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

公开(公告)号：US10772206B2

公开(公告)日：2020-09-08

申请号：US16513004

申请日：2019-07-16

Applicant: Intel Corporation

Inventor： Chee Ling Wong ,  Wil Choon Song ,  Khang Choong Yong ,  Eng Huat Goh ,  Mohd Muhaiyiddin Bin Abdullah ,  Tin Poay Chuah

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

公开(公告)号：US11304299B2

公开(公告)日：2022-04-12

申请号：US17008222

申请日：2020-08-31

Applicant: Intel Corporation

Inventor： Chee Ling Wong ,  Wil Choon Song ,  Khang Choong Yong ,  Eng Huat Goh ,  Mohd Muhaiyiddin Bin Abdullah ,  Tin Poay Chuah

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

公开(公告)号：US20190342996A1

公开(公告)日：2019-11-07

申请号：US16513004

申请日：2019-07-16

Applicant: Intel Corporation

Inventor： Chee Ling Wong ,  Wil Choon Song ,  Khang Choong Yong ,  Eng Huat Goh ,  Mohd Muhaiyiddin Bin Abdullah ,  Tin Poay Chuah

IPC: H05K1/11 ,  H05K1/14

Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.