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公开(公告)号：US20190098764A1
公开(公告)日：2019-03-28
申请号：US16081487
申请日：2016-04-02
Applicant: INTEL CORPORATION
Inventor： ERIC LI , Kemal Aygun , Kai Xiao , Gong Ouyang , Zhichao Zhang
Abstract: Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure 306 on a low density interconnect (LDI) printed circuit board (PCB) 150 according to an LDI fabrication process and forming one or more fme conductive features on the LDI PCB by performing a fme feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fme gap region 308 within the conductive structure. Other embodiments are described and claimed.
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