公开(公告)号：US20170108655A1

公开(公告)日：2017-04-20

申请号：US15394672

申请日：2016-12-29

Applicant: INTEL CORPORATION

Inventor： Edward A. ZARBOCK ,  Debendra MALLIK

IPC: G02B6/42 ,  H01S5/026 ,  H01S5/00

CPC classification number: G02B6/4214 ,  G02B6/4206 ,  G02B6/4238 ,  G02B6/4249 ,  G02B6/4269 ,  G02B6/4274 ,  H01L25/167 ,  H01L2924/0002 ,  H01S5/0071 ,  H01S5/021 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02469 ,  H01S5/0261 ,  H01L2924/00

Abstract: A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.