公开(公告)号：US20210202348A1

公开(公告)日：2021-07-01

申请号：US16727770

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Kyle Arrington ,  Frederick Atadana ,  Taylor Gaines ,  Minseok Ha

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

Abstract: An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

公开(公告)号：US20200219790A1

公开(公告)日：2020-07-09

申请号：US16241158

申请日：2019-01-07

Applicant: INTEL CORPORATION

Inventor： Aastha Uppal ,  Je-Young Chang ,  Weihua Tang ,  Minseok Ha

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.

公开(公告)号：US11842944B2

公开(公告)日：2023-12-12

申请号：US16727770

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Kyle Arrington ,  Frederick Atadana ,  Taylor Gaines ,  Minseok Ha

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

CPC classification number: H01L23/373 ,  H01L21/4882 ,  H01L23/3675

Abstract: An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

公开(公告)号：US11664294B2

公开(公告)日：2023-05-30

申请号：US16241158

申请日：2019-01-07

Applicant: INTEL CORPORATION

Inventor： Aastha Uppal ,  Je-Young Chang ,  Weihua Tang ,  Minseok Ha

IPC: H01L21/56 ,  H01L23/34 ,  H01L23/427 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/09 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L2924/14

Abstract: An integrated circuit assembly may be formed using a phase change material as an electromagnetic shield and as a heat dissipation mechanism for the integrated circuit assembly. In one embodiment, the integrated circuit assembly may comprise an integrated circuit package including a first substrate having a first surface and an opposing second surface, and at least one integrated circuit device having a first surface and an opposing second surface, wherein the at least one integrated circuit device is electrically attached by the first surface thereof to the first surface of the first substrate; and a phase change material formed on the integrated circuit package.