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公开(公告)号：US10825714B2
公开(公告)日：2020-11-03
申请号：US15089480
申请日：2016-04-02
Applicant: INTEL CORPORATION
Inventor： Daniel Chavez-Clemente , Joshua D. Heppner , Naida Duranovic
IPC: H01L21/687 , H01L23/00 , H01L23/538
Abstract: A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.
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