公开(公告)号：US20170181339A1

公开(公告)日：2017-06-22

申请号：US14974113

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Pramod Malatkar ,  Xiao Lu ,  Daniel Chavez-Clemente

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0404 ,  H05K3/30 ,  H05K13/0408

Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.

公开(公告)号：US10825714B2

公开(公告)日：2020-11-03

申请号：US15089480

申请日：2016-04-02

Applicant: INTEL CORPORATION

Inventor： Daniel Chavez-Clemente ,  Joshua D. Heppner ,  Naida Duranovic

IPC: H01L21/687 ,  H01L23/00 ,  H01L23/538

Abstract: A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.

公开(公告)号：US10278318B2

公开(公告)日：2019-04-30

申请号：US14974113

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Pramod Malatkar ,  Xiao Lu ,  Daniel Chavez-Clemente

IPC: H05K13/04 ,  H05K3/30

Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.