公开(公告)号：US20180226334A1

公开(公告)日：2018-08-09

申请号：US15748106

申请日：2015-08-27

Applicant: INTEL CORPORATION

Inventor： ROBERT L. SANKMAN ,  ALLAN A. OVROM, III ,  ROBERT STARKSTON ,  OREN ARAD

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/49894 ,  H01L23/49816 ,  H01L23/5383 ,  H01L24/00 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar. Other embodiments may be described and/or claimed