Abstract:
Methods and apparatuses for combinatorial processing are disclosed. Apparatuses include a wet etch module (WEM) operable to combinatorially etch a substrate having at least two site-isolated regions. The WEM includes a dispense manifold operable to dispense fluids and a mixing vessel unit operable to mix fluids. The WEM further includes a reactor unit operable to receive fluids from the dispense manifold or the mixing vessel unit. The reactor unit can apply a combinatorial process on a substrate having at least two site-isolated regions within the WEM. In addition, a secondary containment unit, having a leak sensor therein, is coupled to the dispense manifold, mixing vessel unit, or reactor unit to receive fluid leaks within the system. When the leak sensor detects a fluid leak, a warning may be generated. Advantageously, the generated warning does not impede substrate processing within the WEM.
Abstract:
Embodiments provided herein describe methods and chemical solutions for cleaning photomasks. A photomask is provided. The photomask is exposed to a chemical solution. The chemical solution includes a quaternary ammonium hydroxide.The quaternary ammonium hydroxide may include at least one of tetraethyl ammonium hydroxide (TEAH), tetrapropyl ammonium hydroxide (TPAH), or a combination thereof. The photomask may be an extreme ultraviolet (EUV) lithography photomask.