公开(公告)号：US11430710B2

公开(公告)日：2022-08-30

申请号：US16773937

申请日：2020-01-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Shidong Li ,  Jay A. Bunt ,  Kenneth C. Marston ,  Hilton Toy ,  Hongqing Zhang ,  David J. Lewison

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/04

Abstract: An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.