公开(公告)号：US09673177B1

公开(公告)日：2017-06-06

申请号：US14969905

申请日：2015-12-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin V. Fasano ,  Mark W. Kapfhammer ,  David J. Lewison ,  Thomas E. Lombardi ,  Thomas Weiss

IPC: H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2225/06513

Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.

公开(公告)号：US20170170148A1

公开(公告)日：2017-06-15

申请号：US14969905

申请日：2015-12-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Benjamin V. Fasano ,  Mark W. Kapfhammer ,  David J. Lewison ,  Thomas E. Lombardi ,  Thomas Weiss

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2225/06513

Abstract: A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.

公开(公告)号：US11614324B2

公开(公告)日：2023-03-28

申请号：US16662158

申请日：2019-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  Jay A. Bunt ,  David J. Lewison ,  Joyce Molinelli Acocella ,  Yu Luo

IPC: H01L21/02 ,  G01B15/02 ,  H01L21/50 ,  H01L21/66

Abstract: Aspects of the invention include a non-destructive bond line thickness measurement of thermal interface material on silicon packages. A non-limiting example computer-implemented method includes receiving a chip mounted on a laminate and depositing a high-density material on the chip. The computer-implemented method deposits a thermal interface material on the chip and lids the chip, and the laminate with a lid. The computer-implemented method X-rays the lid, the chip, and the laminate to produce an X-ray and measures, using a processor, from the X-ray a bond line thickness of the TIM as a distance from a bottom of the lid to a top surface of the high-density material.

公开(公告)号：US12005148B2

公开(公告)日：2024-06-11

申请号：US17245356

申请日：2021-04-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  David J. Lewison ,  Frank L. Pompeo ,  James Busby ,  Jay A. Bunt ,  Joyce E. Molinelli Acocella ,  Madhana Sunder ,  Michael J. Ellsworth, Jr.

IPC: A61L2/10 ,  F21V29/58 ,  H05K7/20

CPC classification number: A61L2/10 ,  F21V29/59 ,  A61L2202/11 ,  A61L2202/14 ,  H05K7/20763

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

公开(公告)号：US20220155049A1

公开(公告)日：2022-05-19

申请号：US16950855

申请日：2020-11-17

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Jay A. Bunt ,  Frank L. Pompeo ,  Richard Walter Oldrey ,  John D. Sylvestri ,  Phong T. Tran

IPC: G01B5/20 ,  G01B5/06 ,  G01B5/30

Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

公开(公告)号：US20210249333A1

公开(公告)日：2021-08-12

申请号：US16787241

申请日：2020-02-11

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Hongqing Zhang ,  Jay A. Bunt ,  Jeffrey A. Zitz ,  Sushumna Iruvanti

IPC: H01L23/40 ,  H01L23/427 ,  F28F13/00

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

公开(公告)号：US11940271B2

公开(公告)日：2024-03-26

申请号：US16950855

申请日：2020-11-17

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Jay A. Bunt ,  Frank L. Pompeo ,  Richard Walter Oldrey ,  John D. Sylvestri ,  Phong T. Tran

IPC: G01B5/20 ,  G01B5/06 ,  G01B5/30 ,  H01L21/67

CPC classification number: G01B5/20 ,  G01B5/06 ,  G01B5/30 ,  H01L21/67253

Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

公开(公告)号：US11716808B2

公开(公告)日：2023-08-01

申请号：US17117267

申请日：2020-12-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  Arthur J. Higby ,  David J. Lewison ,  Philipp K. Buchling Rego ,  Jay A. Bunt ,  James Busby ,  Levi Campbell

IPC: G08B21/00 ,  H05K1/02 ,  F28F13/00 ,  G08B21/18 ,  H05K7/20

CPC classification number: H05K1/0275 ,  F28F13/003 ,  G08B21/18 ,  H05K7/20445 ,  H05K7/20409 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

公开(公告)号：US11430710B2

公开(公告)日：2022-08-30

申请号：US16773937

申请日：2020-01-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Shidong Li ,  Jay A. Bunt ,  Kenneth C. Marston ,  Hilton Toy ,  Hongqing Zhang ,  David J. Lewison

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/04

Abstract: An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

公开(公告)号：US11158562B2

公开(公告)日：2021-10-26

申请号：US16787241

申请日：2020-02-11

Applicant: International Business Machines Corporation

Inventor： David J. Lewison ,  Hongqing Zhang ,  Jay A. Bunt ,  Jeffrey A. Zitz ,  Sushumna Iruvanti

IPC: H01L23/40 ,  H05K7/20 ,  F28F13/00 ,  H01L23/427

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.