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公开(公告)号：US11754323B2
公开(公告)日：2023-09-12
申请号：US17145010
申请日：2021-01-08
Applicant: International Business Machines Corporation
Inventor： Jerry M. Chow , Patryk Gumann
CPC classification number: F25B9/145 , F25B9/10 , F25B2309/1411 , F25B2309/1424 , F25B2500/13
Abstract: Techniques facilitating mechanical vibration management for cryogenic environments are provided. In one example, a system can comprise a processor that executes computer executable components stored in memory. The computer executable components can comprise a linearization component and a drive component. The linearization component can translate data indicative of a nonlinear drive signal into a linear drive signal. The drive component can dynamically control operation of a compressor of a cryocooler using the linear drive signal. The cryocooler can provide cooling capacity for a cryogenic environment.
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公开(公告)号：US20230155593A1
公开(公告)日：2023-05-18
申请号：US17525899
申请日：2021-11-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Baleegh Abdo , Jerry M. Chow
IPC: H03K19/195 , H01L39/22 , H01P1/38 , H01P7/08 , G06N10/00
CPC classification number: H03K19/195 , H01L39/223 , H01P1/38 , H01P7/082 , G06N10/00
Abstract: A quantum circuit includes a quantum signal unit. There is a first quantum chip comprising a plurality of qubit devices and bi-directionally coupled to the quantum signal unit. A first quantum entangling unit is bi-directionally coupled to the quantum signal unit and configured to generate an entanglement between a first and a second qubit device on the first quantum chip via the quantum signal unit.
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公开(公告)号：US20220221198A1
公开(公告)日：2022-07-14
申请号：US17145010
申请日：2021-01-08
Applicant: International Business Machines Corporation
Inventor： Jerry M. Chow , Patryk Gumann
Abstract: Techniques facilitating mechanical vibration management for cryogenic environments are provided. In one example, a system can comprise a processor that executes computer executable components stored in memory. The computer executable components can comprise a linearization component and a drive component. The linearization component can translate data indicative of a nonlinear drive signal into a linear drive signal. The drive component can dynamically control operation of a compressor of a cryocooler using the linear drive signal. The cryocooler can provide cooling capacity for a cryogenic environment.
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公开(公告)号：US20220221108A1
公开(公告)日：2022-07-14
申请号：US17144964
申请日：2021-01-08
Applicant: International Business Machines Corporation
Inventor： Antonio Corcoles-Gonzalez , Patryk Gumann , Jerry M. Chow
IPC: F17C3/08
Abstract: Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.
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公开(公告)号：US20220221105A1
公开(公告)日：2022-07-14
申请号：US17144803
申请日：2021-01-08
Applicant: International Business Machines Corporation
Inventor： Jerry M. Chow , Patryk Gumann
Abstract: Techniques facilitating transfer port systems for cryogenic environments are provided. In one example, an outer vacuum chamber of a cryostat can comprise a sidewall encompassing an inner chamber comprising a sample mounting surface. The sidewall can comprise a feedthrough port providing access to the sample mounting surface from a region external to the outer vacuum chamber.
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Patent Agency Ranking
公开(公告)号：US11329356B2
公开(公告)日：2022-05-10
申请号：US17131916
申请日：2020-12-23
Applicant: International Business Machines Corporation
Inventor： Salvatore Bernardo Olivadese , Patryk Gumann , Jay M. Gambetta , Jerry M. Chow
Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.
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公开(公告)号：US11244241B1
公开(公告)日：2022-02-08
申请号：US17027324
申请日：2020-09-21
Applicant: International Business Machines Corporation
Inventor： Jay Michael Gambetta , Jerry M. Chow , Easwar Magesan , Abhinav Kandala , Zlatko K. Minev
IPC: G06N10/00 , H03K19/195
Abstract: Devices and/or computer-implemented methods to facilitate a cross-resonance operation in a dispersive regime of a qubit frequency space are provided. According to an embodiment, a device can comprise a first qubit having a first operating frequency and a first anharmonicity. The device can further comprise a second qubit that couples to the first qubit to perform a cross-resonance operation. The second qubit having a second operating frequency and a second anharmonicity. A detuning between the first operating frequency and the second operating frequency is larger than the first anharmonicity and the second anharmonicity.
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公开(公告)号：US11189435B2
公开(公告)日：2021-11-30
申请号：US16709350
申请日：2019-12-10
Applicant: International Business Machines Corporation
Inventor： Vivekananda P. Adiga , Martin O. Sandberg , Firat Solgun , Jerry M. Chow
Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a switch device that shifts frequency of a resonator in a quantum device are provided. According to an embodiment, a device can comprise a readout resonator coupled to a qubit. The device can further comprise a switch device formed across the readout resonator that shifts frequency of the readout resonator based on position of the switch device. According to another embodiment, a device can comprise a bus resonator coupled to a plurality of qubits. The device can further comprise a switch device formed across the bus resonator that shifts frequency of the bus resonator based on position of the switch device.
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公开(公告)号：US10833240B2
公开(公告)日：2020-11-10
申请号：US16186255
申请日：2018-11-09
Applicant: International Business Machines Corporation
Inventor： Patryk Gumann , Salvatore Bernardo Olivadese , Jerry M. Chow
Abstract: In an embodiment, a device includes a substrate having a thickness, wherein the thickness is a function of energy dissipation of a particle. In an embodiment, the device includes a thermal layer, formed on the substrate, of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates, and wherein any intervening material exhibits at least a second threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates.
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公开(公告)号：US20200036072A1
公开(公告)日：2020-01-30
申请号：US16591225
申请日：2019-10-02
Applicant: International Business Machines Corporation
Inventor： Salvatore Bernardo Olivadese , Patryk Gumann , Jay M. Gambetta , Jerry M. Chow
Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.
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