公开(公告)号：US12218048B2

公开(公告)日：2025-02-04

申请号：US17936845

申请日：2022-09-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Vivekananda P. Adiga ,  Russell A. Budd ,  Charles Thomas Rettner ,  Stephen M. Gates

IPC: H01L23/525 ,  H01L23/532

Abstract: A method of constructing a superconducting switch includes depositing a thin sacrificial layer on top of a substrate. The sacrificial layer is patterned to remove portions of the sacrificial layer except at a first portion of the substrate. A superconducting metal layer is patterned on top of the substrate and on top of the sacrificial layer. The superconducting metal layer is patterned to form a superconducting metal line over the sacrificial layer. The patterned sacrificial layer is etched from under the superconducting metal line to release the metal line from the substrate.

公开(公告)号：US11750189B2

公开(公告)日：2023-09-05

申请号：US17133996

申请日：2020-12-24

Applicant: International Business Machines Corporation

Inventor： Elbert Emin Huang ,  Charles Thomas Rettner ,  Michael Justin Beckley ,  Russell A. Budd ,  Vivekananda P. Adiga ,  David C. Mckay ,  Sarah Elizabeth Sheldon

IPC: H03K17/92 ,  G06N10/00

CPC classification number: H03K17/92 ,  G06N10/00

Abstract: Devices and/or computer-implemented methods to facilitate a programmable and/or reprogrammable quantum circuit are provided. According to an embodiment, a device can comprise a superconducting coupler device having a superconducting fuse device that is used to alter the coupling of a first quantum computing element and a second quantum computing element.

公开(公告)号：US11158782B2

公开(公告)日：2021-10-26

申请号：US16681331

申请日：2019-11-12

Applicant: International Business Machines Corporation

Inventor： Richard Alan Haight ,  Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik

IPC: H01L39/24 ,  H01L39/12 ,  H01L39/22

Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing a metal fluoride layer onto a superconducting resonator and a silicon substrate that can be comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the metal fluoride layer can coat the superconducting resonator.

公开(公告)号：US11145801B2

公开(公告)日：2021-10-12

申请号：US16681295

申请日：2019-11-12

Applicant: International Business Machines Corporation

Inventor： Richard Alan Haight ,  Ali Afzali-Ardakani ,  Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik

IPC: H01L39/02 ,  G06N10/00 ,  H01L39/24 ,  H01L39/22

Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer onto a superconducting resonator and a silicon substrate that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.

公开(公告)号：US11126776B2

公开(公告)日：2021-09-21

申请号：US16840930

申请日：2020-04-06

Applicant: International Business Machines Corporation

Inventor： Salvatore Bernardo Olivadese ,  Vivekananda P. Adiga ,  Jared Barney Hertzberg

IPC: G06F30/392 ,  G06F30/20 ,  G06F119/10 ,  G06N10/00

Abstract: A system includes a memory that stores computer executable components, and a processor executes the computer executable components stored in the memory. The computer executable components comprise: an assessment component that determines locations for mode suppression structures on a coplanar waveguide of a quantum chip having qubits; a simulation component that simulates performance of the quantum chip based on a subset of the locations for the mode suppression structures and parameters of the quantum chip, and generates a mode suppression structures placement model. A template component generates a template of specific coordinates for placement of a subset of the mode suppression structures on the quantum chip based on the mode suppression structures placement model; and a driver component employs the template to drive an auto-bonder to install the subset of the mode suppression structures on the quantum chip at the specific coordinates.

公开(公告)号：US20210264308A1

公开(公告)日：2021-08-26

申请号：US16802503

申请日：2020-02-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Martin O. Sandberg ,  Vivekananda P. Adiga ,  Hanhee Paik

IPC: G06N10/00

Abstract: A resonator is based on a coplanar waveguide (CPW) structure that includes a first end portion having a first width and configured to be coupled to a first qubit. There is a a middle portion having a second width that is narrower than the first width. There is a second end portion having a third width that is wider than the second width and configured to be coupled to a second qubit.

公开(公告)号：US11004896B1

公开(公告)日：2021-05-11

申请号：US16676304

申请日：2019-11-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik ,  Jerry M. Chow

IPC: H01L27/18 ,  B82Y10/00 ,  G06N10/00 ,  H01L39/02 ,  H01L39/22 ,  B82Y30/00

Abstract: According to an embodiment of the present invention, a system for non-invasively characterizing a qubit device includes a characterization probe chip. The characterization probe chip includes a substrate and a characterization resonator formed on a first surface of the substrate. The characterization resonator includes a superconducting stripline, and a superconducting antenna coupled to an end of the superconducting stripline, the superconducting antenna positioned to align with a qubit on the qubit device being characterized. The characterization probe chip also includes and a superconducting ground plane formed on a second surface of the substrate, the second surface opposing the first surface. In operation, the superconducting antenna is configured to capacitively couple the characterization resonator to the qubit aligned with the superconducting antenna for characterization of the qubit.

公开(公告)号：US20210134880A1

公开(公告)日：2021-05-06

申请号：US16676304

申请日：2019-11-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Vivekananda P. Adiga ,  Martin O. Sandberg ,  Hanhee Paik ,  Jerry M. Chow

IPC: H01L27/18 ,  G06N10/00 ,  H01L39/22 ,  H01L39/02

Abstract: According to an embodiment of the present invention, a system for non-invasively characterizing a qubit device includes a characterization probe chip. The characterization probe chip includes a substrate and a characterization resonator formed on a first surface of the substrate. The characterization resonator includes a superconducting stripline, and a superconducting antenna coupled to an end of the superconducting stripline, the superconducting antenna positioned to align with a qubit on the qubit device being characterized. The characterization probe chip also includes and a superconducting ground plane formed on a second surface of the substrate, the second surface opposing the first surface. In operation, the superconducting antenna is configured to capacitively couple the characterization resonator to the qubit aligned with the superconducting antenna for characterization of the qubit.

公开(公告)号：US10900998B1

公开(公告)日：2021-01-26

申请号：US16687143

申请日：2019-11-18

Applicant: International Business Machines Corporation

Inventor： Martin O. Sandberg ,  Vivekananda P. Adiga ,  Hanhee Paik ,  Jared Barney Hertzberg

IPC: G06N10/00 ,  G01Q60/00

Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

公开(公告)号：US20200335549A1

公开(公告)日：2020-10-22

申请号：US16387420

申请日：2019-04-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Martin O. Sandberg ,  Vivekananda P. Adiga ,  Rasit O. Topaloglu

IPC: H01L27/18 ,  H01L39/02 ,  H01L39/24 ,  G06N10/00

Abstract: A fluxonium qubit includes a superinductor. The superinductor includes a substrate, and a first vertical stack extending in a vertical direction from a surface of the substrate. The first vertical stack includes a first Josephson junction and a second Josephson junction connected in series along the vertical direction. The superinductor includes a second vertical stack extending in a vertical direction from a surface of the substrate. The second vertical stack includes a third Josephson junction. The superinductor includes a superconducting connector connecting the first and second vertical stacks in series such that the first, second, and third Josephson junctions are connected in series. The fluxonium qubit further includes a shunted Josephson junction connected to the superinductor with superconducting wires such that the first, second, and third Josephson junctions of the superinductor that are in series are connected in parallel with the shunted Josephson junction.