公开(公告)号：US20200006233A1

公开(公告)日：2020-01-02

申请号：US16025031

申请日：2018-07-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kyle I. GIESEN ,  Matteo COCCHINI ,  Kyle WONDERLY ,  Zachary T. DREISS ,  Juan MARTINEZ-MANTILLA

IPC: H01L23/538 ,  H01L23/367 ,  H05K3/42 ,  H05K3/40 ,  H05K1/02

Abstract: A pin assembly is provided for a plated via of a circuit board. The pin assembly includes a pin sized for insertion into the plated via, and a plurality of expandable elements affixed to the pin. A conductive coating is disposed over the pin and over the plurality of expandable elements. With the pin assembly inserted into the plated via, one or more expandable elements of the plurality of expandable elements can be expanded within the plated via to enhance contact of the pin assembly to a wall of the plated via.