公开(公告)号：US20140198452A1

公开(公告)日：2014-07-17

申请号：US13743642

申请日：2013-01-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Thomas J. BRUNSCHWILER ,  Evan G. COLGAN ,  Michael J. ELLSWORTH, JR. ,  Werner ESCHER ,  Ingmar MEIJER ,  Stephen PAREDES ,  Gerd SCHLOTTIG ,  Jeffrey A. ZITZ

IPC: H05K7/20 ,  H05K13/00

CPC classification number: H05K13/00 ,  H05K7/20772 ,  Y10T29/49002

Abstract: Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces.

Abstract translation: 提供冷却的电子组件和制造方法。 在一个实施例中，组件包括具有一个或多个电子部件的冷却剂冷却的电子模块和集成在模块内的一个或多个冷却剂输送通道，并且构造成便于冷却剂流过模块，用于 冷却电子部件。 此外，组件包括可拆卸地联接到电子模块的冷却剂歧管结构。 歧管结构便于冷却剂流到电子模块的冷却剂输送通道，并且冷却剂歧管结构和电子模块包括相邻的表面。 相邻表面的一个表面包括多个冷却剂毛细管或通道。 冷却剂毛细管的尺寸被限制为例如通过表面张力来阻止冷却剂在一个表面处的泄漏，同时使冷却剂歧管结构和电子模块沿相邻的表面脱离。