公开(公告)号：US20140051211A1

公开(公告)日：2014-02-20

申请号：US14064811

申请日：2013-10-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Suresh D. KADAKIA ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Jeffrey A. ZITZ

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/433 ,  H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.

Abstract translation: 提供了一种多芯片电子封装及其制造方法。 多芯片封装包括安装在芯片载体上的多个芯片。 多芯片封装还包括使用接合材料或压缩密封件安装在芯片载体上的盖和从盖延伸的至少一个单个活塞。 每个活塞覆盖多个芯片的整个多个芯片。