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    REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER OF AN ELECTRONIC PACKAGE
    3.
    发明申请
    REDUCING DIRECTIONAL STRESS IN AN ORTHOTROPIC ENCAPSULATION MEMBER OF AN ELECTRONIC PACKAGE 有权
    减少电子包装的正交包封件中的方向应力

    公开(公告)号：US20170053845A1

    公开(公告)日：2017-02-23

    申请号：US14832156

    申请日：2015-08-21

    Applicant: International Business Machines Corporation

    Inventor： Marcus E. INTERRANTE ,  Yi PAN ,  Hilton T. TOY ,  Jeffrey A. ZITZ

    IPC: H01L23/16 ,  H01L21/48 ,  H01L21/50 ,  H01L23/373 ,  H01L23/498

    CPC classification number: H01L23/16 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/562

    Abstract: Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.

    Abstract translation: 用于减小电子封装的正交各向异性包封构件中的方向应力的方法和装置可包括将加强框架附接到载体上，加强框架包括中心开口以接纳半导体芯片和多个相对的侧壁，电连接半导体芯片 与所述载体同心地布置在所述中心开口内，并且使所述定向散热器与所述半导体芯片热接触，所述定向散热器从所述半导体芯片传递热量，其中所述定向散热器被成形为沿着所述相对双向器方向减小方向应力 。

    COOLING STRUCTURE FOR ELECTRONIC BOARDS
    4.
    发明申请
    COOLING STRUCTURE FOR ELECTRONIC BOARDS 有权
    电子板冷却结构

    公开(公告)号：US20160165755A1

    公开(公告)日：2016-06-09

    申请号：US14561663

    申请日：2014-12-05

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

    IPC: H05K7/20

    CPC classification number: H05K7/20263 ,  G06F1/203 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/46 ,  H01L23/467 ,  H01L23/473 ,  H01L35/30 ,  H05K1/181 ,  H05K7/20254 ,  H05K7/20272 ,  H05K2201/2018

    Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

    Abstract translation: 公开了一种具有紧密间隔异种模具和封装的大型电子板的冷却结构。 组件包括具有多个开口的框架。 组件还包括安装到框架的冷板。 冷板包括与至少一个入口和至少一个出口连通的至少一个入口和至少一个出口和流体通道。 组件还包括安装在多个开口中的每一个内的散热器，其结合框架的开口的侧壁和冷板形成各自与流体通道流体连通的各个隔室。

    MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
    9.
    发明申请
    MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE 有权
    MULTICHIP电子包装及其制造方法

    公开(公告)号：US20140027898A1

    公开(公告)日：2014-01-30

    申请号：US14041875

    申请日：2013-09-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Kamal K. SIKKA ,  Hilton T. TOY ,  Krishna R. TUNGA ,  Jeffrey A. ZITZ

    IPC: H01L23/04 ,  H01L21/50

    CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/10 ,  H01L23/562 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2924/01322 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/166 ,  H01L2924/00

    Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes adjusting a piston position of one or more pistons with respect to one or more chips on a chip carrier. The adjusting includes placing a chip shim on the chips and placing a seal shim between a lid and the chip carrier. The seal shim is thicker than the chip shim. The adjusting further includes lowering the lid until the pistons contact the chip shim. The method further includes separating the lid and the chip carrier and removing the chip shim and the seal shim. The method further includes dispensing thermal interface material on the chips and lowering the lid until a gap filled with the thermal interface material is about a particle size of the thermal interface material. The method further includes sealing the lid to the chip carrier with sealant.

    Abstract translation: 提供了一种多芯片电子封装及其制造方法。 该方法包括相对于芯片载体上的一个或多个芯片来调节一个或多个活塞的活塞位置。 调整包括将芯片垫片放置在芯片上，并将密封垫片放置在盖子和芯片载体之间。 密封垫片比芯片垫片厚。 该调节还包括降低盖直到活塞接触芯片垫片。 该方法还包括分离盖和芯片载体并移除芯片垫片和密封垫片。 该方法还包括将热界面材料分配在芯片上并降低盖子，直到填充有热界面材料的间隙大约为热界面材料的粒度。 该方法还包括用密封剂将盖子密封到芯片载体上。

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