公开(公告)号：US09165863B2

公开(公告)日：2015-10-20

申请号：US13932076

申请日：2013-07-01

Applicant: INTERSIL AMERICAS INC.

Inventor： Randolph Cruz

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49541 ,  H01L2224/32245

Abstract: Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.

Abstract translation: 提供了引线框锁定设计特点的系统和方法。 在一个实施例中，一种方法包括：制造用于芯片封装的引线框架，所述引线框架具有桨叶，所述桨叶包括横跨所述桨叶边缘的至少第一段的逐步底部锁定特征轮廓，其提供与 模具复合; 蚀刻所述桨叶以使所述边缘的至少第二段具有延伸出的底部锁定特征轮廓或悬垂顶部锁定特征轮廓; 以及沿桨叶的边缘交替的第一和第二段。

公开(公告)号：US20130285226A1

公开(公告)日：2013-10-31

申请号：US13932076

申请日：2013-07-01

Applicant: INTERSIL AMERICAS INC.

Inventor： Randolph Cruz

IPC: H01L23/495

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49541 ,  H01L2224/32245

Abstract: Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.