专利检索 ap:("IRINA BELOV" OR "DARYL G. COPELAND") AND inv:"IRINA BELOV" 第 1 页

1.

发明申请
CHROMATE-FREE CERAMIC COATING COMPOSITIONS 有权
标题翻译：无铬陶瓷涂料组合物

公开(公告)号：US20150183998A1

公开(公告)日：2015-07-02

申请号：US14657536

申请日：2015-03-13

申请人： IRINA BELOV , DARYL G. COPELAND

发明人： IRINA BELOV , DARYL G. COPELAND

IPC分类号： C09D5/08

CPC分类号： C09D5/08 , C04B28/26 , C04B28/34 , C04B2111/00482 , C04B2111/00577 , C04B2111/1075 , C09D1/02 , C23C24/082 , C23C28/04 , C04B14/303 , C04B20/008 , C04B14/066 , C04B14/307 , C04B40/0263 , C04B14/305

摘要： A novel chromate-free multi-layer coating system composed of a lithium-doped potassium silicate binder based basecoat composition that is sealed with an aluminum phosphate-based top coat composition is described. The multi-layer coating system exhibits superior corrosion and heat oxidation resistance which can replace traditional chromate-containing coating systems.

摘要翻译： 描述了一种由基于磷酸铝的面漆组合物密封的掺锂硅酸钾粘合剂基础组合物组成的无铬酸盐多层涂层体系。多层涂层系统表现出优异的耐腐蚀和耐热氧化性能，可代替传统的含铬酸盐涂层体系。

2.

发明申请
CHROMIUM-FREE SILICATE-BASED CERAMIC COMPOSITIONS 有权

公开(公告)号：US20150184303A1

公开(公告)日：2015-07-02

申请号：US14657490

申请日：2015-03-13

申请人： IRINA BELOV , DARYL G. COPELAND

发明人： IRINA BELOV , DARYL G. COPELAND

IPC分类号： C23C28/04 , C23F4/04 , C09D5/08 , B05D3/00

CPC分类号： C23C28/04 , B05D3/007 , B05D2350/60 , C09D5/08 , C23C24/08 , C23C30/00 , C23F4/04

摘要： A composition based on a certain chromium-free silicate-based binder is described. The one-part slurry composition is an aqueous solution of lithium-doped potassium silicate in combination with an aluminum or aluminum alloy powder. The one-part slurry composition produces a corresponding coating exhibiting improved performance at a reduced coating thickness.

3.

发明申请
Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator 审中-公开
标题翻译：使用具有多官能活化剂的浆料对铜结构进行化学机械抛光的方法

公开(公告)号：US20080257862A1

公开(公告)日：2008-10-23

申请号：US12166765

申请日：2008-07-02

申请人： IRINA BELOV , Timothy D. Moser

发明人： IRINA BELOV , Timothy D. Moser

IPC分类号： C23F1/02 , B44C1/22

CPC分类号： C23F3/06 , C09G1/02 , C09K3/1454 , C09K3/1463 , H01L21/3212

摘要： The present invention relates to aqueous slurry/solution compositions for the Chemical Mechanical Polishing/Planarization (“CMP”) of substrates. In particular, the novel slurries/solutions of the present invention contain a multifunctional activator which provides increased copper removal rate to the aqueous polishing slurry/solution while suppressing isotropic chemical etch and dishing of copper lines.

摘要翻译： 本发明涉及用于基材的化学机械抛光/平面化（“CMP”）的含水浆料/溶液组合物。特别地，本发明的新型浆液/溶液含有一种多功能活化剂，其在抑制铜线的各向同性化学蚀刻和凹陷的同时，对水性抛光浆料/溶液提供增加的铜去除速率。