公开(公告)号：US20240002653A1

公开(公告)日：2024-01-04

申请号：US18314100

申请日：2023-05-08

申请人： ITEQ CORPORATION

发明人： SHENG-YEN WU ,  SHOU-NENG TO ,  YA-PING LIU ,  CHEN-HAO CHANG ,  PEI-CHUN LAI

IPC分类号： C08L63/00 ,  H05K1/05 ,  H05K1/03

CPC分类号： C08L63/00 ,  H05K1/056 ,  H05K1/0346 ,  C08L2205/025 ,  C08L2205/035

摘要： A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.

公开(公告)号：US20210298169A1

公开(公告)日：2021-09-23

申请号：US17204962

申请日：2021-03-18

申请人： ITEQ CORPORATION

发明人： YEN-HSING WU ,  CHEN-HAO CHANG

IPC分类号： H05K1/03

摘要： A resin composition, a prepreg, and a printed circuit board are provided. The resin composition is used to form a dielectric substrate layer. The resin composition includes a polymeric based material and fillers. Based on a total volume of the resin composition being 100 vol %, the resin composition includes 10 vol % to 60 vol % of the polymeric based material and 1 vol % to 80 vol % of the fillers. The fillers include hollow fillers, and the hollow fillers include a first hollow filler. A material of the first hollow filler is silicon dioxide.