公开(公告)号：US20240002653A1

公开(公告)日：2024-01-04

申请号：US18314100

申请日：2023-05-08

申请人： ITEQ CORPORATION

发明人： SHENG-YEN WU ,  SHOU-NENG TO ,  YA-PING LIU ,  CHEN-HAO CHANG ,  PEI-CHUN LAI

IPC分类号： C08L63/00 ,  H05K1/05 ,  H05K1/03

CPC分类号： C08L63/00 ,  H05K1/056 ,  H05K1/0346 ,  C08L2205/025 ,  C08L2205/035

摘要： A resin composition and a metal clad substrate are provided. The resin composition includes: 5 phr to 15 phr of a maleimide resin, 5 phr to 30 phr of a benzoxazine resin, 40 phr to 70 phr of an epoxy resin, and 40 phr to 60 phr of fillers. An amount of fluorine atoms contained in the maleimide resin ranges from 10 wt % to 50 wt %.