公开(公告)号：US20210147646A1

公开(公告)日：2021-05-20

申请号：US16822013

申请日：2020-03-18

申请人： ITEQ CORPORATION

发明人： MING LIU ,  TSUNG-LIEH WENG ,  SHAO-JIE YUAN ,  KAI-YANG CHEN ,  TA-YUAN YU

IPC分类号： C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03 ,  H05K1/09

摘要： A prepreg, a laminated board, and a printed circuit board thereof are provided. The prepreg includes a halogen-free epoxy resin composition and a partially cured non-woven reinforcing material impregnated therein. The non-woven reinforcing material has a dielectric strength of 1.5 to 4.8 and a loss factor that is less than 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes: (a) 100 parts by weight of a halogen-free naphthalene type epoxy resin, (b) 10 to 25 parts by weight of a DOPO modifying curing agent, (c) 25 to 45 parts by weight of a cyanate resin, (d) 35 to 60 parts by weight of bismaleimide, (e) 45 to 65 parts by weight of a non-DOPO flame retardant, and (f) 0.5 to 15 parts by weight of a curing accelerator.

公开(公告)号：US20190202168A1

公开(公告)日：2019-07-04

申请号：US15969922

申请日：2018-05-03

申请人： ITEQ CORPORATION

发明人： TA-YUAN YU ,  KAI-YANG CHEN ,  YEN-HSING WU

IPC分类号： B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

摘要： A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.