公开(公告)号：US20230348673A1

公开(公告)日：2023-11-02

申请号：US17964158

申请日：2022-10-12

申请人： ITEQ CORPORATION

发明人： Sheng-Yen WU ,  Po-Hsun LEE ,  Chun-Ming CHIU ,  Wen-Pin SU ,  Jui-Teng HSU ,  Chen-Yu HUANG ,  Chun-Han LIN

IPC分类号： C08G73/10 ,  C08K3/36 ,  C08K7/14 ,  C08J5/24

CPC分类号： C08G73/1067 ,  C08K3/36 ,  C08K7/14 ,  C08J5/244 ,  C08J2379/08

摘要： The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.