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公开(公告)号：US20230348708A1
公开(公告)日：2023-11-02
申请号：US18075967
申请日：2022-12-06
申请人： ITEQ CORPORATION
发明人： Sheng-Yen WU , Tzu-Fang CHEN , Po-Kai TSENG , Yu-Chieh HSU , Te-Chieh LI , Shao-Wei YU
CPC分类号： C08L63/00 , C08J5/244 , B32B5/02 , B32B5/26 , B32B15/14 , B32B15/20 , C08J2363/00 , C08J2451/06 , C08J2479/08 , C08L2205/03 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2250/05 , B32B2250/40
摘要： The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a polybenzoxazine compound, an anhydride grafted olefin polymer, and a diisocyanate compound; and (B) a thermosetting polymer; wherein, in the toughened and modified compound, the diisocyanate compound forms a bond with the polybenzoxazine compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace, and the like.
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公开(公告)号：US20230348673A1
公开(公告)日：2023-11-02
申请号：US17964158
申请日：2022-10-12
申请人： ITEQ CORPORATION
发明人： Sheng-Yen WU , Po-Hsun LEE , Chun-Ming CHIU , Wen-Pin SU , Jui-Teng HSU , Chen-Yu HUANG , Chun-Han LIN
CPC分类号： C08G73/1067 , C08K3/36 , C08K7/14 , C08J5/244 , C08J2379/08
摘要： The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.
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