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公开(公告)号:US3816564A
公开(公告)日:1974-06-11
申请号:US22299472
申请日:1972-02-02
Applicant: ITT
Inventor: HOLLIDAY H , SCHURTER G
IPC: C08L23/00 , C08L1/00 , C08L7/00 , C08L21/00 , C08L27/00 , C08L101/00 , C09D4/00 , C09D5/25 , H01B3/44 , C08F15/00 , C08F29/00
Abstract: A COMPOSITION IS DISCLOSED FOR USE IN PROVIDING ELECTRICAL INSULATION. THE COMPOSITION IS ONE WHICH MAY BE DIP-COATED AND CURED TO PROVIDE SUPERIOR RESISTANCE TO TEMPERATURE, ABRASION, AND TO PROVIDE HIGH ELECTRICAL RESISTANCE. THE COMPOSITIONS DISCLOSED COMPRISED A CURABLE COMPOSITION COMPRISING A MIXTURE OF A POLYOLEFIN, POLYVINYL CHLORIDE AND A REACTIVE ALLYLIC OR VINYLIC COMPOUND OR MIXTURE. THE COMPOSITION MAY THEN BE COATED OR APPLIED TO THE ELECTRICAL MEMBER AND CURED.