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公开(公告)号：US12113406B2
公开(公告)日：2024-10-08
申请号：US18512748
申请日：2023-11-17
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J. F. Tighe
CPC分类号： H02K11/33 , H02K5/08 , H02K5/15 , H02K5/18 , H02K5/225 , H02K7/14 , H02K9/06 , H02K11/27 , H02K2211/03
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US11824406B2
公开(公告)日：2023-11-21
申请号：US17444900
申请日：2021-08-11
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J. F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US11777380B2
公开(公告)日：2023-10-03
申请号：US17444902
申请日：2021-08-11
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J. F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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4.外观设计公开(公告)号：USD747225S1
公开(公告)日：2016-01-12
申请号：US29516282
申请日：2015-01-30
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公开(公告)号：US20240195270A1
公开(公告)日：2024-06-13
申请号：US18512748
申请日：2023-11-17
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J.F. Tighe
CPC分类号： H02K11/33 , H02K5/08 , H02K5/15 , H02K5/18 , H02K5/225 , H02K7/14 , H02K9/06 , H02K11/27 , H02K2211/03
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US11855495B2
公开(公告)日：2023-12-26
申请号：US17444898
申请日：2021-08-11
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J. F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US20220021284A1
公开(公告)日：2022-01-20
申请号：US17444899
申请日：2021-08-11
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J.F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US11777379B2
公开(公告)日：2023-10-03
申请号：US17444899
申请日：2021-08-11
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J. F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US11489418B2
公开(公告)日：2022-11-01
申请号：US17078800
申请日：2020-10-23
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J. F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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公开(公告)号：US20220021283A1
公开(公告)日：2022-01-20
申请号：US17444898
申请日：2021-08-11
发明人： Dean P. Williams , Mark A. Playford , Daniel J. Kernan , Lee Empringham , Liliana V. De Lillo , Christopher J.F. Tighe
摘要： A motor assembly for driving a pump or rotary device features a power plane with a circular geometry to be mounted inside a space envelope having a similar circular geometry formed on an end-plate between an inner hub portion and a peripheral portion that extends circumferentially around the space envelope of the end-plate. The power plane is a multi-layer circuit board or assembly having: a power layer with higher temperature power modules for providing power to a motor, a control layer with lower temperature control electronics modules for controlling the power provided to the motor, and a thermal barrier and printed circuit board layer between the power layer and the control layer that provides electrical connection paths between the power modules of the power plane and the control electronics modules of the control layer, and also provides insulation between the power layer and the control layer.
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