公开(公告)号：US06225570B1

公开(公告)日：2001-05-01

申请号：US09125260

申请日：1998-08-10

申请人： Ichiro Ishiyama ,  Ichiro Nagare ,  Morikatsu Yamazaki ,  Yozo Ohara ,  Koji Higashi

发明人： Ichiro Ishiyama ,  Ichiro Nagare ,  Morikatsu Yamazaki ,  Yozo Ohara ,  Koji Higashi

IPC分类号： H05K116

CPC分类号： H05K1/162 ,  H05K1/095 ,  H05K1/165 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  H05K2203/171

摘要： This invention provides a circuit board having an electric component which has an electric element smaller than a conventional element. A circuit pattern (5) which includes a pair of contact electrodes (3, 3) is formed on the surface of a board (1) made of an insulating material. A photoresist film (7) is formed on the surface of the board (1). At least one electric element forming hole (9) is formed in the photoresist film (7) by a lithography technology so as to expose at least part of the pair of the contact electrodes (3, 3). The electric element forming hole (9) is filled with an electric element forming paste material to form an electric element (13). A protective film (15) made of a synthetic resin is so formed as to cover the electric element forming hole (9).

摘要翻译： 本发明提供一种电路板，其具有比常规元件小的电气元件的电气部件。 在由绝缘材料制成的板（1）的表面上形成包括一对接触电极（3,3）的电路图案（5）。 在板（1）的表面上形成光致抗蚀剂膜（7）。 通过光刻技术在光致抗蚀剂膜（7）中形成至少一个电子元件形成孔（9），以暴露所述一对接触电极（3,3）的至少一部分。 电元件形成孔（9）填充有电子元件形成膏材以形成电元件（13）。 由合成树脂制成的保护膜（15）形成为覆盖电气元件形成孔（9）。