公开(公告)号：US20130237639A1

公开(公告)日：2013-09-12

申请号：US13822453

申请日：2011-09-27

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

IPC分类号： C08L63/00

CPC分类号： C08L63/00 ,  C08G8/36 ,  C08G59/621 ,  C08G2261/135 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/598 ,  C08G2261/76 ,  C08L61/14 ,  C08L65/00

摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

摘要翻译： 考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基 含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。 该酚醛树脂用作环氧树脂的固化剂。

公开(公告)号：US20130184377A1

公开(公告)日：2013-07-18

申请号：US13812972

申请日：2011-07-19

申请人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

发明人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

IPC分类号： C08L73/00

CPC分类号： C08L73/00 ,  C08G8/04 ,  C08L63/00 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.

摘要翻译： 本发明提供了一种热稳定性树脂组合物，其具有优异的流动性，并且实现了适用于近期电子元件相关材料的耐湿可靠性，并且在无卤素状态下与环境和谐相处的高阻燃性，其固化产物，半导体 使用该组合物的封装材料，以及赋予这些性能的酚醛树脂和环氧树脂。 作为必要成分，作为必要成分的热固性树脂组合物包含环氧树脂（A）和酚醛树脂（B），酚醛树脂（B）具有作为基本骨架的酚醛树脂结构，其中多个 含酚羟基的芳族骨架（ph）通过具有芳烃结构的亚烷基或亚甲基彼此键合，并且酚醛树脂结构的芳香核具有萘甲基或蒽基甲基。

公开(公告)号：US08703845B2

公开(公告)日：2014-04-22

申请号：US13822453

申请日：2011-09-27

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

IPC分类号： C08G59/32 ,  C08G59/62 ,  C08G59/06 ,  C08G61/02 ,  C08L63/00 ,  H01L21/56

CPC分类号： C08L63/00 ,  C08G8/36 ,  C08G59/621 ,  C08G2261/135 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/598 ,  C08G2261/76 ,  C08L61/14 ,  C08L65/00

摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

摘要翻译： 考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基 含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。 该酚醛树脂用作环氧树脂的固化剂。