Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
    9.
    发明授权
    Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material 失效
    可固化树脂组合物,其固化产物,酚醛树脂,环氧树脂和半导体密封材料

    公开(公告)号:US08703845B2

    公开(公告)日:2014-04-22

    申请号:US13822453

    申请日:2011-09-27

    摘要: A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

    摘要翻译: 考虑到环境友好性,实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基(ph1),含酚羟基的芳族烃基(ph2)和通式(2)表示的二价芳烷基(X)的结构部分 1)(其中Ar表示亚苯基或亚联苯基,Rs各自独立地表示氢原子或甲基),并且具有选自由以下组成的组中的多个芳族烃基的结构:萘基甲氧基或蒽基甲氧基 含有芳香族烃基(ph1)和含酚性羟基的芳香族烃基(ph2)通过二价芳烷基(X)键合。 该酚醛树脂用作环氧树脂的固化剂。

    POLYMERIZATION SOLUTION, CONDUCTIVE POLYMER FILM OBTAINED FROM THE POLYMERIZATION SOLUTION, POLYMER ELECTRODE, AND SOLID ELECTROLYTIC CAPACITOR
    10.
    发明申请
    POLYMERIZATION SOLUTION, CONDUCTIVE POLYMER FILM OBTAINED FROM THE POLYMERIZATION SOLUTION, POLYMER ELECTRODE, AND SOLID ELECTROLYTIC CAPACITOR 有权
    聚合溶液,由聚合溶液获得的导电聚合物膜,聚合物电极和固体电解电容器

    公开(公告)号:US20140022701A1

    公开(公告)日:2014-01-23

    申请号:US14002248

    申请日:2012-03-01

    IPC分类号: C25B3/10 H01G9/15 H01G9/042

    摘要: Disclosed is a polymerization solution for electrolytic polymerization having a small environmental load, having excellent economic efficiency and capable of producing a conductive polymer exhibiting excellent heat resistance. The polymerization solution has: a solvent consisting of 100 to 80% by mass of water and 0 to 20% by mass of an organic solvent; at least one monomer selected from the group consisting of 3,4-disubstituted thiophenes; and at least one organic non-sulfonate supporting electrolyte having an anion with the molecular weight of 200 or more. A conductive polymer film densely filled with polymer particles is obtained by performing electrolytic polymerization using the polymerization solution. A polymer electrode provided with the conductive polymer film exerts excellent heat resistance and the electrochemical activity of the polymer electrode will hardly deteriorate even when being subjected to high temperatures. Moreover, a solid electrolyte capacitor containing the conductive polymer layer obtained by performing electrolytic polymerization using the polymerization solution exhibits low dielectric loss and equivalent series resistance and exerts excellent heat resistance.

    摘要翻译: 公开了一种环境负荷小的电解聚合用聚合液,经济效益优异,能够制造具有优异耐热性的导电性聚合物。 聚合溶液具有:由100〜80质量%的水和0〜20质量%的有机溶剂构成的溶剂, 至少一种选自3,4-二取代噻吩的单体; 和至少一种具有分子量为200以上的阴离子的有机非磺酸盐担载电解质。 通过使用聚合溶液进行电解聚合,获得密实地填充有聚合物颗粒的导电聚合物膜。 设置有导电性聚合物膜的聚合物电极具有优异的耐热性,并且即使经受高温,聚合物电极的电化学活性也几乎不劣化。 此外,含有通过使用聚合溶液的电解聚合获得的导电聚合物层的固体电解质电容器具有低的介电损耗和等效的串联电阻,并且具有优异的耐热性。