摘要:
An organic polymer having an asymmetric structure, a preparation method thereof and a use as a photoelectric material thereof, where the organic polymer with an asymmetric structure is obtained by polymerization after performing Stille coupling reaction between an electron-donating unit D and an electron-withdrawing unit A in the presence of a solvent and a catalyst. The compound of the present application has good heat stability, controllable absorption level, and is suitable for the preparation of hole transport materials of high-performance perovskite solar cells with high efficiency, flexibility, good stability and a large area as well as donor materials of organic solar cells.
摘要:
The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).
摘要:
Objects of the present invention are to provide an organic semiconductor element in which carrier mobility is high, variation of mobility is suppressed, and temporal stability under high temperature and high humidity is excellent, and a manufacturing method thereof, to provide a novel compound suitable for an organic semiconductor, and to provide an organic semiconductor film in which mobility is high, variation of mobility is suppressed, and temporal stability under high temperature and high humidity is excellent, a manufacturing method thereof, and an organic semiconductor composition that can suitably form the organic semiconductor film.The organic semiconductor element according to the present invention is an organic semiconductor layer containing a compound having a constitutional repeating unit represented by Formula 1 and having a molecular weight of 2,000 or greater. D-A (1)
摘要:
A flame retardant coating composition comprising poly(dopamine) and either tris(hydroxymethyl)aminomethane) or gaseous ammonia, as well as an article comprising a substrate and the flame retardant coating composition, is provided. In various embodiments, the poly(dopamine) is substantially water insoluble. The coating composition can further comprise at least one additional component selected from the group consisting of melamine, an anionic clay, a phosphorus-containing compound, an amine-containing compound, aluminosilicates, silicon oxides, and combinations thereof. Also provided are methods for forming the flame retardant coating composition and methods for increasing flame retardant properties of a substrate.
摘要:
An object of the invention is to provide an organic semiconductor element in which mobility is high, heat resistance is excellent, and variation of mobility is suppressed, and a manufacturing method thereof, to provide a novel compound that is suitable as an organic semiconductor, and to provide an organic semiconductor film in which mobility is high, heat resistance is excellent, and variation of mobility is suppressed and a composition for forming an organic semiconductor film that can suitably form the organic semiconductor film.The organic semiconductor element according to the invention has an organic semiconductor layer containing a compound having a constitutional repeating unit represented by Formula 1 or 2 below.
摘要:
A fluoroelastomer comprising a copolymer of fluoroolefin monomers selected from one or more of the group consisting of 2,3,3,3-tetrafluoropropene, 1,3,3,3-tetrafluoropropene and 1-chloro-3,3,3-trifluoropropene, and ethylenically unsaturated co-monomers; wherein the fluoroelastomer has a glass transition temperature (Tg) of from about −60° C. to about 53° C. A process of making the fluoroelastomer.
摘要:
The present invention provides: a crosslinkable resin formed article that is obtained by impregnating an inorganic fibrous support with a polymerizable composition, and subjecting the polymerizable composition to bulk polymerization, the polymerizable composition comprising (A) a cycloolefin monomer, (B) a metathesis polymerization catalyst, (C) a crosslinking agent, (D) an inorganic filler that consists of particles having an average particle size of 0.1 to 1.0 μm, and (E) an inorganic filler that consists of particles having an average particle size of 1.5 to 5.0 μm, the polymerizable composition having a total content of the component (D) and the component (E) of 60 to 80 wt %, and having a weight ratio (component (D):component (E)) of the component (D) to the component (E) of 5:95 to 40:60; a crosslinked resin formed article obtained by crosslinking the crosslinkable resin formed article; and a laminate produced by stacking the crosslinkable resin formed articles.
摘要:
A crosslinked product of a polyarylene is disclosed, having high-temperature elastomeric properties and excellent chemical resistance. The crosslinked materials are useful in oil and gas downhole applications in the form of either solids or foams. Methods for the manufacture of the crosslinked product and articles comprising the product are also disclosed.
摘要:
A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.
摘要:
Disclosed is a polymerization solution for electrolytic polymerization having a small environmental load, having excellent economic efficiency and capable of producing a conductive polymer exhibiting excellent heat resistance. The polymerization solution has: a solvent consisting of 100 to 80% by mass of water and 0 to 20% by mass of an organic solvent; at least one monomer selected from the group consisting of 3,4-disubstituted thiophenes; and at least one organic non-sulfonate supporting electrolyte having an anion with the molecular weight of 200 or more. A conductive polymer film densely filled with polymer particles is obtained by performing electrolytic polymerization using the polymerization solution. A polymer electrode provided with the conductive polymer film exerts excellent heat resistance and the electrochemical activity of the polymer electrode will hardly deteriorate even when being subjected to high temperatures. Moreover, a solid electrolyte capacitor containing the conductive polymer layer obtained by performing electrolytic polymerization using the polymerization solution exhibits low dielectric loss and equivalent series resistance and exerts excellent heat resistance.