公开(公告)号：US11365117B2

公开(公告)日：2022-06-21

申请号：US16726025

申请日：2019-12-23

Applicant: Industrial Technology Research Institute

Inventor： Heng-chung Chang ,  Jhih-Jie Huang ,  Chih-Ya Tsai ,  Jing-Yuan Lin

IPC: B81B7/00 ,  B81C1/00

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.