MEMS device and manufacturing method of the same

    公开(公告)号:US11365117B2

    公开(公告)日:2022-06-21

    申请号:US16726025

    申请日:2019-12-23

    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.

    OPTICAL SENSING CHIP
    2.
    发明申请
    OPTICAL SENSING CHIP 有权
    光传感芯片

    公开(公告)号:US20140198376A1

    公开(公告)日:2014-07-17

    申请号:US13875305

    申请日:2013-05-02

    CPC classification number: G01N21/658 B82Y15/00 Y10S977/92

    Abstract: The present invention relates to an optical sensing chip, which has various applications and may be used repetitively. The optical sensing chip can qualitatively identify different types of molecules and quantitatively analyze small molecules in minute amounts. Regarding a conventional optical sensing chip, an additional sample of known concentration is required as a reference in signal comparison for quantitative determination. In the disclosure, it is unnecessary to add the additional sample of known concentration, but the optical sensing chip itself provides a fixed optical signal that is not varied along with environmental changes to serve as a reference for quantitative determination. In addition, the optical sensing chip also possesses the ability to concentrate or filter sample in real-time.

    Abstract translation: 本发明涉及光传感芯片,其具有各种应用并可重复使用。 光学感测芯片可以定性识别不同类型的分子,并以微量定量分析小分子。 关于传统的光学感测芯片,需要附加的已知浓度的样品作为用于定量测定的信号比较中的参考。 在本公开中,不需要添加已知浓度的附加样品,但是光学感测芯片本身提供了不随环境变化而变化的固定光信号,以用作用于定量测定的参考。 此外,光学感测芯片还具有实时浓缩或过滤样品的能力。

    Pressure sensor and manufacturing method of the same
    4.
    发明授权
    Pressure sensor and manufacturing method of the same 有权
    压力传感器及其制造方法相同

    公开(公告)号:US09400224B2

    公开(公告)日:2016-07-26

    申请号:US14485082

    申请日:2014-09-12

    Abstract: A pressure sensor and a manufacturing method of the same are provided. The pressure sensor includes a substrate, a dielectric oxide layer, a first electrode, a dielectric connection layer, and a second electrode. The dielectric oxide layer is formed on the substrate. The first electrode is formed on the dielectric oxide layer. The dielectric connection layer is formed on the first electrode. The second electrode is formed on the dielectric connection layer. The second electrode comprises a patterned conductive layer and a dielectric layer. The patterned conductive layer has a plurality of holes, and the dielectric layer is formed on the patterned conductive layer and covers the inner walls of the plurality of holes. The first electrode, the dielectric connection layer, and the second electrode define a first chamber between the first electrode and the second electrode.

    Abstract translation: 提供了一种压力传感器及其制造方法。 压力传感器包括基板,电介质氧化物层,第一电极,电介质连接层和第二电极。 电介质氧化物层形成在基板上。 第一电极形成在电介质氧化物层上。 介电连接层形成在第一电极上。 第二电极形成在电介质连接层上。 第二电极包括图案化导电层和电介质层。 图案化导电层具有多个孔,并且介电层形成在图案化导电层上并覆盖多个孔的内壁。 第一电极,电介质连接层和第二电极在第一电极和第二电极之间限定第一室。

    Tunable optical device
    6.
    发明授权

    公开(公告)号:US11137590B2

    公开(公告)日:2021-10-05

    申请号:US15067195

    申请日:2016-03-11

    Abstract: A tunable optical device including a substrate, at least one support unit, a flexible frame, an elastic component, a first reflector, and at least one actuator is provided. The support unit is fixed onto the substrate. The flexible frame is connected to the support unit and suspended above the substrate. The elastic component is connected to the flexible frame. A stiffness of the elastic component in the Z-axis is smaller than a stiffness of the flexible frame in the Z-axis. The Z-axis direction is parallel to a normal direction of the substrate. The first reflector is connected to the elastic component. The actuator is located between the flexible frame and the substrate or located between the first reflector and the substrate.

    Optical sensing chip having three-dimensional nanostructure array

    公开(公告)号:US09658164B2

    公开(公告)日:2017-05-23

    申请号:US13875305

    申请日:2013-05-02

    CPC classification number: G01N21/658 B82Y15/00 Y10S977/92

    Abstract: The present invention relates to an optical sensing chip, which has various applications and may be used repetitively. The optical sensing chip can qualitatively identify different types of molecules and quantitatively analyze small molecules in minute amounts. Regarding a conventional optical sensing chip, an additional sample of known concentration is required as a reference in signal comparison for quantitative determination. In the disclosure, it is unnecessary to add the additional sample of known concentration, but the optical sensing chip itself provides a fixed optical signal that is not varied along with environmental changes to serve as a reference for quantitative determination. In addition, the optical sensing chip also possesses the ability to concentrate or filter sample in real-time.

    Optical package
    8.
    发明授权

    公开(公告)号:US10345147B2

    公开(公告)日:2019-07-09

    申请号:US15391413

    申请日:2016-12-27

    Abstract: An optical package is provided. The optical package includes an interference splitter allowing a light having a predetermined wavelength range to transmit through, a sensing element, and a light-transmitting structure. The light-transmitting structure includes a light-transmitting pillar and a light-absorbing layer surrounding the light-transmitting pillar, and the light-absorbing layer absorbs the light having the predetermined wavelength range. The interference splitter, the light-transmitting pillar, and the sensing element are arranged aligned with each other along an extending direction of the light-transmitting pillar. The sensing element is configured to receive the light transmitting through the interference splitter and the light-transmitting pillar.

    INFRARED DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20230366739A1

    公开(公告)日:2023-11-16

    申请号:US17993942

    申请日:2022-11-24

    CPC classification number: G01J5/20

    Abstract: An infrared device is provided. The infrared device includes a substrate, a metal layer, a first semiconductor layer, an absorber layer, and a second semiconductor layer. The metal layer is disposed on the substrate. The first semiconductor layer is disposed on the substrate and electrically connected to the metal layer. A cavity is formed between the first semiconductor layer and the metal layer. The absorber layer is disposed on the first semiconductor layer. The second semiconductor layer is disposed on the absorber layer and electrically connected to the first semiconductor layer. The TCR of the first semiconductor layer is different from that of the second semiconductor layer.

    Suspension particle sensing apparatus

    公开(公告)号:US10921230B2

    公开(公告)日:2021-02-16

    申请号:US16214149

    申请日:2018-12-10

    Abstract: A suspension particle sensing apparatus includes a first flow channel, a suspension particle concentration sensor and a suspension particle filtering assembly. The first flow channel has a first entrance and a first exit. The suspension particle concentration sensor is disposed in the first flow channel, and is located between the first entrance and the first exit. The suspension particle filtering assembly is disposed at the first entrance, and includes a casing and a suspension particle filtering structure. The casing has a first opening and a second opening. The first opening is communicated with the first entrance of the first flow channel. The suspension particle filtering structure covers the second opening.

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