公开(公告)号：US20230163034A1

公开(公告)日：2023-05-25

申请号：US17578447

申请日：2022-01-19

Applicant: Industrial Technology Research Institute

Inventor： Lung-Tai Chen ,  Chin-Sheng Chang ,  Bor-Shiun Lee ,  Chih-Hsiang Ko

IPC: H01L23/06

CPC classification number: H01L23/06

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.

公开(公告)号：US20240363456A1

公开(公告)日：2024-10-31

申请号：US18334396

申请日：2023-06-14

Applicant: Industrial Technology Research Institute

Inventor： Lung-Tai Chen ,  Chin-Sheng Chang ,  Bor-Shiun Lee ,  Liang-Ju Chien

IPC: H01L23/04 ,  G01N33/00 ,  H01L21/56 ,  H01L23/06 ,  H01L23/31

CPC classification number: H01L23/04 ,  G01N33/0027 ,  H01L21/565 ,  H01L23/06 ,  H01L23/315

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, an air hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed with an encapsulation material and has a body portion and a plurality of anchors. The air hole penetrates the body portion of the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and has a shielding part shielding the air hole and an embedded part embedded in the lid body. The embedded part has an upper surface and a lower surface. The upper surface and the lower surface respectively have a plurality of recesses. The anchors are respectively located in the recesses.

公开(公告)号：US12191219B2

公开(公告)日：2025-01-07

申请号：US17578447

申请日：2022-01-19

Applicant: Industrial Technology Research Institute

Inventor： Lung-Tai Chen ,  Chin-Sheng Chang ,  Bor-Shiun Lee ,  Chih-Hsiang Ko

IPC: H01L23/06

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.