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公开(公告)号：US11820650B2
公开(公告)日：2023-11-21
申请号：US16882039
申请日：2020-05-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Bor-Shiun Lee , Ming-Fa Chen , Yu-Wen Hsu , Chao-Ta Huang
CPC classification number: B81B7/02 , B81C1/00246 , G01K7/186 , G01L19/0092 , G01N27/223 , B81B2201/0264 , B81B2201/0278
Abstract: The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.
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公开(公告)号：US20240363456A1
公开(公告)日：2024-10-31
申请号：US18334396
申请日：2023-06-14
Applicant: Industrial Technology Research Institute
Inventor： Lung-Tai Chen , Chin-Sheng Chang , Bor-Shiun Lee , Liang-Ju Chien
CPC classification number: H01L23/04 , G01N33/0027 , H01L21/565 , H01L23/06 , H01L23/315
Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, an air hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed with an encapsulation material and has a body portion and a plurality of anchors. The air hole penetrates the body portion of the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and has a shielding part shielding the air hole and an embedded part embedded in the lid body. The embedded part has an upper surface and a lower surface. The upper surface and the lower surface respectively have a plurality of recesses. The anchors are respectively located in the recesses.
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公开(公告)号：US11965852B2
公开(公告)日：2024-04-23
申请号：US17719342
申请日：2022-04-12
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Pei-Chi Kuo , Bor-Shiun Lee , Ming-Fa Chen
CPC classification number: G01N27/128 , G01N33/0062
Abstract: A microelectromechanical sensor includes a base, a heater provided on the base, and a sensing electrode including a sensing portion. The heater includes a heating portion. The heater and the sensing electrode are provided at different layers in a stacking direction, and the sensing electrode is electrically insulated from the heater. On a reference plane in the stacking direction, a projection of the sensing portion of the sensing electrode is entirely covered by a projection of the heating portion of the heater.
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公开(公告)号：US11656128B2
公开(公告)日：2023-05-23
申请号：US17729884
申请日：2022-04-26
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chin-Jou Kuo , Bor-Shiun Lee , Ming-Fa Chen
CPC classification number: G01J5/20 , B81B3/0072 , B81C1/00666 , B81B2201/0278 , B81B2203/04 , B81C2201/0104 , B81C2201/0107
Abstract: A MEMS infrared sensing device includes a substrate and an infrared sensing element. The infrared sensing element is provided above the substrate and has a sensing area and an infrared absorbing area which do not overlap each other. The infrared sensing element includes two infrared absorbing structures, an infrared sensing layer provided between the two infrared absorbing structures, and an interdigitated electrode structure located in the sensing area. Each of the two infrared absorbing structures includes at least one infrared absorbing layer, and the two infrared absorbing structures are located in the sensing area and the infrared absorbing area. The infrared sensing layer is located in the sensing area and does not extend into the infrared absorbing area. The interdigitated electrode structure is in electrical contact with the infrared sensing layer.
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Patent Agency Ranking
公开(公告)号：US11366015B1
公开(公告)日：2022-06-21
申请号：US17240077
申请日：2021-04-26
Applicant: Industrial Technology Research Institute
Inventor： Bor-Shiun Lee , Ming-Fa Chen
Abstract: A microelectromechanical infrared sensing device is provided, which includes a substrate, a sensing plate, a reflecting plate, a plurality of first supporting elements, a plurality of second supporting elements and a plurality of stoppers. The second supporting elements are connected to the sensing plate, such that the sensing plate is suspended above the substrate. The reflecting plate is disposed between the substrate and the sensing plate. The first supporting elements are connected to the reflecting plate, such that the reflecting plate is suspended between the substrate and the reflecting plate. When the reflecting plate moves toward the substrate and at least one of the stoppers contacts the substrate or the reflecting plate, the distance between the reflecting plate and the sensing plate increases.
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公开(公告)号：US20230163034A1
公开(公告)日：2023-05-25
申请号：US17578447
申请日：2022-01-19
Applicant: Industrial Technology Research Institute
Inventor： Lung-Tai Chen , Chin-Sheng Chang , Bor-Shiun Lee , Chih-Hsiang Ko
IPC: H01L23/06
CPC classification number: H01L23/06
Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.
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公开(公告)号：US12191219B2
公开(公告)日：2025-01-07
申请号：US17578447
申请日：2022-01-19
Applicant: Industrial Technology Research Institute
Inventor： Lung-Tai Chen , Chin-Sheng Chang , Bor-Shiun Lee , Chih-Hsiang Ko
IPC: H01L23/06
Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.
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公开(公告)号：US11543297B2
公开(公告)日：2023-01-03
申请号：US16886036
申请日：2020-05-28
Applicant: Industrial Technology Research Institute
Inventor： Ying-Che Lo , Yu-Sheng Lin , Ting-Hao Hsiao , Bor-Shiun Lee
Abstract: A sensing device is provided. The sensing device includes a plurality of infrared thermosensitive elements and a plurality of resistor-capacitor (RC) oscillators. The plurality of infrared thermosensitive elements are arranged in an array. Each of the plurality of infrared thermosensitive elements has a resistance value which changes with a temperature of the infrared thermosensitive element by absorbing infrared radiation and generates a sensing voltage corresponding to the resistance value. The plurality of RC oscillators are coupled to the plurality of infrared thermosensitive elements to receive the corresponding sensing values, respectively. Each of the plurality of RC oscillators generates a digital sensing signal according to the corresponding sensing value to indicate the temperature of the corresponding infrared thermosensitive element. Each of the plurality of RC oscillators is disposed under the corresponding infrared thermosensitive element.
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公开(公告)号：US11359970B2
公开(公告)日：2022-06-14
申请号：US16904820
申请日：2020-06-18
Applicant: Industrial Technology Research Institute
Inventor： Bor-Shiun Lee , Ming-Fa Chen , Ying-Che Lo , Chao-Ta Huang
Abstract: A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.
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