公开(公告)号：US20130105089A1

公开(公告)日：2013-05-02

申请号：US13661049

申请日：2012-10-26

Applicant: Industrial Technology Research Institute

Inventor： Ru-De Chen ,  Hsin-Yun Hsu

IPC: B32B38/10 ,  B32B33/00 ,  B32B3/24

CPC classification number: B32B38/10 ,  B32B3/266 ,  B32B3/30 ,  B32B7/06 ,  B32B2307/538 ,  B32B2309/105 ,  B32B2310/04 ,  H01L21/67092 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  Y10T156/11 ,  Y10T428/24331

Abstract: A method for separating a substrate assembly is provided. A substrate assembly including a first substrate and a second substrate is provided first. The second substrate has at least a through hole. The first substrate and the second substrate are adhered together so that the through hole exposes the first substrate. A fluid is then injected between the first substrate and the second substrate through the through hole so as to separate the first substrate from the second substrate.

Abstract translation: 提供了一种分离衬底组件的方法。 首先提供包括第一基板和第二基板的基板组件。 第二基板具有至少一个通孔。 第一基板和第二基板粘合在一起，使得通孔露出第一基板。 然后通过通孔将流体注入第一基板和第二基板之间，以将第一基板与第二基板分离。