公开(公告)号：US20040056236A1

公开(公告)日：2004-03-25

申请号：US10246460

申请日：2002-09-19

Applicant: Industrial Technology Research Institute

Inventor： Hsun-Tien Li ,  Shu-Chen Huang ,  Kai-Chi Chen

IPC: H01B001/00

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  Y10T428/2995

Abstract: Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.

Abstract translation: 细导电颗粒由金属导电粉末和粉末颗粒上的绝缘有机覆盖层组成。 金属导电粉末具有直径范围为1至20微米的晶粒，并且覆盖层具有50-400nm的厚度，其能够通过热压而流动。 绝缘有机覆盖层由具有反应性官能团的硅烷，含氟硅烷和具有能够与反应性官能团反应的官能团的化合物或树脂制备。