公开(公告)号：US20130187135A1

公开(公告)日：2013-07-25

申请号：US13744207

申请日：2013-01-17

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jing-Yi YAN ,  Shu-Tang YEH ,  Chih-Chieh HSU ,  Chen-Wei LIN ,  Kuang-Jung CHEN

IPC: H01L51/52

CPC classification number: H01L51/5228 ,  H01L27/3244

Abstract: A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.

Abstract translation: 发光器件包括衬底和设置在其上的多个发光结构。 每个发光结构包括设置在基板上的辅助电极，设置在基板上并覆盖辅助电极的第一绝缘层，设置在第一绝缘层上的电极，设置在第一绝缘层上的第二绝缘层， 暴露电极的第一开口，设置在第一开口中的有机发光层，设置在有机发光层上的阴极，至少穿过第一绝缘层和第二绝缘层的导电结构，以及闭环结构 设置在第二绝缘层上并围绕阴极，其中闭环结构的厚度大于阴极的厚度。

公开(公告)号：US20210202333A1

公开(公告)日：2021-07-01

申请号：US15931525

申请日：2020-05-13

Applicant: Industrial Technology Research Institute

Inventor： Hong-Ming DAI ,  Jane-Hway LIAO ,  Yen-Ching KUO ,  Shu-Tang YEH ,  Wei-Lung TSAI ,  Hung-Yi CHEN ,  Chien-Chang HUNG

IPC: H01L23/29 ,  H01L23/31

Abstract: An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.

公开(公告)号：US20220068519A1

公开(公告)日：2022-03-03

申请号：US17466872

申请日：2021-09-03

Applicant: Industrial Technology Research Institute

Inventor： Hung-Yi CHEN ,  Yen-Ching KUO ,  Hong-Ming DAI ,  Shu-Tang YEH ,  Wen-lung CHEN ,  Jane-Hway LIAO

IPC: H01B7/04 ,  G09F9/30

Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.