公开(公告)号：US20180101015A1

公开(公告)日：2018-04-12

申请号：US15410311

申请日：2017-01-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Pin-Hao HU ,  Mao-Chi LIN ,  Yu-Chung LIN ,  Min-Kai LEE

IPC: G02B27/09 ,  G02B27/30 ,  B23K26/351 ,  B23K26/06

Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

公开(公告)号：US20190314871A1

公开(公告)日：2019-10-17

申请号：US16133199

申请日：2018-09-17

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-Ming CHEN ,  Chien-Jung HUANG ,  Yu-Chung LIN ,  Chieh-Ting TSENG ,  Min-Kai LEE

IPC: B08B7/00 ,  B23K26/067 ,  B23K26/06

Abstract: A laser cleaning apparatus and a laser cleaning method are furnished, for switching the wavelengths of laser beams furnished by a single laser module using a wavelength switching module and cleaning a test piece using the laser beams having wavelengths and energy suitable for manufacturing needs. The laser cleaning method includes: creating a laser beam; switching the wavelength output by the laser based on process requirements; propagating the laser beam via an optical path propagating module for laser cleaning the test piece; and removing debris. A transfer platform allows movements of the laser beams with respect to the test piece to achieve cleaning of the entire test piece. A control module controls the wavelength switching unit, the laser beam regulating module, and the transfer platform. Total laser cleaning with improved laser cleaning quality is achieved by using these laser beams with the appropriate wavelengths and energy.

公开(公告)号：US20250041975A1

公开(公告)日：2025-02-06

申请号：US18464438

申请日：2023-09-11

Applicant: Industrial Technology Research Institute

Inventor： Jyun-Jhih WANG ,  Chun-Ming CHEN ,  Yu-Chung LIN ,  Pin-Hao HU ,  Chien-Jung HUANG

IPC: B23K26/53 ,  B23K26/06 ,  B23K26/067 ,  B23K26/08

Abstract: A laser slicing apparatus, in which a laser module provides a laser beam, and a light splitting element of a focusing lens set splits the laser beam into a plurality of focused laser beams to form a plurality of induce lines having first laser modified cracks in a modified layer at a predetermined depth inside a substrate. A rotating module rotates the light splitting element with an angle, and the light splitting element converts the focused laser beams according to this angle to form a plurality of modified groups between the induce lines. Each modified group includes a plurality of modified lines having second laser modified cracks, and the first laser modified cracks and the second laser modified cracks are connected to each other to form a continuous laser modified crack in the modified layer at the predetermined depth inside the substrate, thereby speeding up the laser slicing production.