公开(公告)号：US20220130751A1

公开(公告)日：2022-04-28

申请号：US17131771

申请日：2020-12-23

Applicant: Industrial Technology Research Institute

Inventor： Ming-Huei Yen ,  Wen-Jin Li ,  Zi-Ting Lin ,  Yu-Ling Chang

IPC: H01L23/498 ,  H01L23/373 ,  B32B15/01 ,  B32B15/20

Abstract: A copper plating structure and a package structure including the same are provided, and the copper plating structure includes at least one first copper layer and at least one second copper layer. The first copper layer includes a (111) crystal plane, wherein a proportion of the (111) crystal plane in each of the first copper layers is 36% to 100%. The second copper layer is located on the first copper layer and includes a non-(111) crystal plane or includes a (111) crystal plane and a non-(111) crystal plane, wherein a proportion of the (111) crystal plane in each of the second copper layers is 0% to 57%.