公开(公告)号：US09141902B2

公开(公告)日：2015-09-22

申请号：US13631929

申请日：2012-09-29

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Kristof Bothe ,  Juergen Hoegerl ,  Andreas Karl ,  Andreas Mueller-Hipper ,  Peter Scherl ,  Peter Stampka ,  Uwe Wagner

IPC: G06K19/02 ,  G06K19/077

CPC classification number: G06K19/07747

Abstract: A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.

Abstract translation: 一种用于智能卡的智能卡模块，包括：在前侧具有电触点的芯片; 第一层叠层，其中所述芯片的后侧连接到所述第一层压层，所述芯片的与所述前侧相对的后侧; 第二层压层; 第一导电层，其中所述芯片的电触点连接到所述第一导电层，并且所述第一导电层布置在所述芯片和所述第二层压层之间; 以及布置在所述芯片和所述导电层和/或所述第二层压层之间的粘合剂材料。

公开(公告)号：US20130082112A1

公开(公告)日：2013-04-04

申请号：US13631929

申请日：2012-09-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Kristof Bothe ,  Juergen Hoegerl ,  Andreas Karl ,  Andreas Mueller-Hipper ,  Peter Scherl ,  Peter Stampka ,  Uwe Wagner

IPC: G06K19/077 ,  B32B37/12

CPC classification number: G06K19/07747

Abstract: The present invention describes a smart card module for a smart card, comprising a first laminate layer, a chip having electric contacts, a first conductive layer, wherein the electrical contacts of the chip are connected to the conductive layer and the first conductive layer is arranged between the chip and the first laminate layer, and wherein the smart card module furthermore comprises an adhesive means, wherein the adhesive means is arranged between the chip and the first conductive layer and/or the first laminate layer.

Abstract translation: 本发明描述了一种用于智能卡的智能卡模块，包括第一层压层，具有电触点的芯片，第一导电层，其中芯片的电触点连接到导电层，第一导电层被布置 在所述芯片和所述第一层压层之间，并且其中所述智能卡模块还包括粘合剂装置，其中所述粘合剂装置布置在所述芯片和所述第一导电层和/或所述第一层压层之间。