公开(公告)号：US20230095545A1

公开(公告)日：2023-03-30

申请号：US17950662

申请日：2022-09-22

Applicant: Infineon Technologies AG

Inventor： Paul Armand Calo ,  Thomas Bemmerl ,  Joo Ming Goa ,  Edward Myers ,  Wee Boon Tay ,  Stefan Macheiner ,  Markus Dinkel ,  Andreas Piller

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

Abstract: A semiconductor package includes a leadframe including a diepad and a first row of leads, wherein at least one lead of the first row of leads is physically separated from the diepad by a gap. The semiconductor package further includes a semiconductor component arranged on the leadframe. The semiconductor package further includes an encapsulation material encapsulating the leadframe and the semiconductor component, wherein the encapsulation material includes a bottom surface arranged at a bottom surface of the semiconductor package, a top surface and a side surface extending from the bottom surface to the top surface. A side surface of at least one lead of the first row of leads is flush with the side surface of the encapsulation material. The flush side surface of the at least one lead is covered by an electroplated metal coating.