公开(公告)号：US20220254696A1

公开(公告)日：2022-08-11

申请号：US17575038

申请日：2022-01-13

Applicant: Infineon Technologies AG

Inventor： Angela KESSLER ,  Kok Yau CHUA ,  Josef HOEGLAUER ,  Chiah Chin LIM ,  Mei Qi TAY

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/538 ,  H01L21/52

Abstract: A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.