公开(公告)号：US20210287964A1

公开(公告)日：2021-09-16

申请号：US17196652

申请日：2021-03-09

Applicant: Infineon Technologies AG

Inventor： Petteri PALM ,  Robert FEHLER ,  Josef HOEGLAUER ,  Angela KESSLER

IPC: H01L23/485 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device is disclosed. In one example, the semiconductor device includes a semiconductor chip including a first chip contact pad on a first chip main surface. The semiconductor device further includes a first electrically conductive layer arranged over the first chip main surface and electrically coupled to the first chip contact pad, wherein the first electrically conductive layer extends in a direction parallel to the first chip main surface. An electrical through connection is electrically coupled to the first electrically conductive layer and to a second electrically conductive layer, wherein the electrical through connection extends in a direction perpendicular to the first chip main surface, and wherein, in a top view of the first chip main surface, the electrical through connection and the semiconductor chip are non-overlapping.

公开(公告)号：US20220254696A1

公开(公告)日：2022-08-11

申请号：US17575038

申请日：2022-01-13

Applicant: Infineon Technologies AG

Inventor： Angela KESSLER ,  Kok Yau CHUA ,  Josef HOEGLAUER ,  Chiah Chin LIM ,  Mei Qi TAY

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/538 ,  H01L21/52

Abstract: A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.