公开(公告)号：US20230327310A1

公开(公告)日：2023-10-12

申请号：US18193196

申请日：2023-03-30

Applicant: Infineon Technologies AG

Inventor： Stefano DI MARTINO ,  Dominik AMSCHL ,  Thomas THURNER

IPC: H01P3/12 ,  H01P5/00

CPC classification number: H01P3/12 ,  H01P5/00

Abstract: An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves. The apparatus includes a coupling element. The coupling element includes a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure. The apparatus further includes a vacuum channel structure including an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.