公开(公告)号：US20210328560A1

公开(公告)日：2021-10-21

申请号：US16851616

申请日：2020-04-17

Applicant: Infineon Technologies AG

Inventor： Stefano DI MARTINO ,  Philipp Franz FREIDL

IPC: H03F3/21 ,  H03F3/24 ,  H03F1/02

Abstract: A system may include a first power detector to measure a power level of a signal on a first transmitter channel, a second power detector to measure a power level of a signal on a second transmitter channel. The system may include a combiner to provide a combined signal associated with the signal on the first transmitter channel and the signal on the second transmitter channel, and a third power detector to measure a power level of the combined signal. The system may include a processing circuit to determine a relative phase difference between the signal on the first transmitter channel and the signal on the second transmitter channel based on results of measuring the power level of the signal on the first transmitter channel, measuring the power level of the signal on the second transmitter channel, and measuring the power level of the combined signal.

公开(公告)号：US20230327310A1

公开(公告)日：2023-10-12

申请号：US18193196

申请日：2023-03-30

Applicant: Infineon Technologies AG

Inventor： Stefano DI MARTINO ,  Dominik AMSCHL ,  Thomas THURNER

IPC: H01P3/12 ,  H01P5/00

CPC classification number: H01P3/12 ,  H01P5/00

Abstract: An apparatus for detachably coupling with a printed circuit board to transfer electromagnetic waves. The apparatus includes a coupling element. The coupling element includes a first wave transmission structure configured to receive the electromagnetic waves from the printed circuit board and to transmit the electromagnetic waves along the first wave transmission structure. The apparatus further includes a vacuum channel structure including an inlet for coupling the apparatus to a vacuum generator to generate a vacuum between a first surface of the coupling element and a second surface of the printed circuit board such that a force between the coupling element and the printed circuit board is applied.

公开(公告)号：US20220326279A1

公开(公告)日：2022-10-13

申请号：US17225462

申请日：2021-04-08

Applicant: Infineon Technologies AG

Inventor： Stefano DI MARTINO ,  Thomas THURNER

IPC: G01R1/067 ,  G01R31/28

Abstract: A wafer probe alignment system includes a test probe needle including a body having a tip that is configured to make contact with a surface of a wafer at a first tip position, wherein the body is deformable and includes a sensing area that undergoes a deformation in response to at least one force, including a lateral friction force, applied to the tip; at least one sensor configured to monitor the sensing area for deformation caused by a lateral friction force and generate at least one first sensor information representative of the lateral friction force; and a controller configured to control a position of the tip, wherein the controller is configured to receive the at least one first sensor information and reposition the tip to counteract the lateral friction force in order to maintain the tip at the first tip position.